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Integration Of Poly...
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Errando-Herranz, CarlosKTH,Mikro- och nanosystemteknik
(author)
Integration Of Polymer Microfluidic Channels, Vias, And Connectors With Silicon Photonic Sensors By One-Step Combined Photopatterning And Molding Of OSTE
- Article/chapterEnglish2013
Publisher, publication year, extent ...
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IEEE conference proceedings,2013
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electronicrdacarrier
Numbers
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LIBRIS-ID:oai:DiVA.org:kth-124548
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-124548URI
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https://doi.org/10.1109/Transducers.2013.6627092DOI
Supplementary language notes
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Language:English
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Summary in:English
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Classification
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Subject category:ref swepub-contenttype
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Subject category:kon swepub-publicationtype
Notes
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QC 20130718
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We demonstrate a method for the fast and simple packaging of silicon sensors into a microfluidic package consisting of the recently introduced {OSTE} polymer. The microfluidic layer is first microstructured and thereafter dry-bonded to a silicon photonic sensor, in a process compatible with wafer-level production, and with the entire packaging process lasting only 10 minutes. The fluidic layer combines molded microchannels and fluidic (Luer) connectors with photopatterned through-holes (vias) for optical fiber probing and fluid connections. All the features are fabricated in a single photocuring step. We report measurements with an integrated silicon photonic {Mach-Zehnder} interferometer refractive index sensor packaged by these means.
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Added entries (persons, corporate bodies, meetings, titles ...)
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Saharil, FarizahKTH,Mikro- och nanosystemteknik(Swepub:kth)u1481q3i
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Mola Romero, Albert
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Sandström, NiklasKTH,Mikro- och nanosystemteknik(Swepub:kth)u1m0o5yh
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Shafagh, Reza Z.KTH,Mikro- och nanosystemteknik(Swepub:kth)u1pwebmi
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Wijngaart, Wouter van derKTH,Mikro- och nanosystemteknik(Swepub:kth)u1wdbont
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Haraldsson, TommyKTH,Mikro- och nanosystemteknik(Swepub:kth)u1ohdrr6
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Gylfason, Kristinn B.,1978-KTH,Mikro- och nanosystemteknik(Swepub:kth)u1v3y7u7
(author)
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KTHMikro- och nanosystemteknik
(creator_code:org_t)
Related titles
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In:Proceedings of the 2013 17th International Solid-State Sensors, Actuators and Microsystems Conference (Transducers): IEEE conference proceedings, s. 1613-1616
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