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High throughput architecture for CLICHÉ network on chip

Abd El Ghany, M. A. (author)
El-Moursy, M. A. (author)
Ismail, Mohammed (author)
KTH,Elektroniksystem,(RaMSiS Group)
 (creator_code:org_t)
2009
2009
English.
In: Proceedings - IEEE International SOC Conference, SOCC 2009. - 9781424452200 ; , s. 155-158
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • High Throughput Chip-Level Integration of Communicating Heterogeneous Elements (CLICHÉ) architecture to achieve high performance Networks on Chip (NoC) is proposed. The architecture increases the throughput of the network by 40% while preserving the average latency. The area of High Throughput CLICHÉ switch is decreased by 18% as compared to CLICHÉ switch. The total metal resources required to implement High Throughput CLICHÉ design is increased by 7% as compared to the total metal resources required to implement CLICHÉ design. The extra power consumption required to achieve the proposed architecture is 8% of the total power consumption of the CLICHÉ architecture.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

CLICHÉ
Latency
NoC
Throughput

Publication and Content Type

ref (subject category)
kon (subject category)

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El-Moursy, M. A.
Ismail, Mohammed
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