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Process development...
Process development and reliability for system-in-a-package using liquid crystal polymer substrate
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Chen, L. (author)
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- Duo, Xingzhong (author)
- KTH,Mikroelektronik och informationsteknik, IMIT
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- Zheng, Lirong (author)
- KTH,Mikroelektronik och informationsteknik, IMIT
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Lai, Z. (author)
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Liu, J. (author)
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(creator_code:org_t)
- 2004
- 2004
- English.
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In: Proc Electron Compon Technol Conf. ; , s. 24-28
- Related links:
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Subject headings
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- In this study, embedded chip technology for system-in-a-package (SiP) application using liquid crystal polymer (LCP) substrate was developed and the reliability issue for embedded structure was evaluated. To this end two test chips with daisy chain joints were used with one copper layer. After assembly, modules were exposed to thermal cycling. The failure was investigated by SEM, and compared with finite element method (FEM) simulation results. Passive components as inductors were also fabricated on the LCP during the embedded technology. Their inductance and quality factors were simulated and discussed.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- Computer simulation
- Copper
- Etching
- Finite element method
- Inductance
- Liquid crystal polymers
- Microprocessor chips
- Permittivity
- Photolithography
- Reliability
- Scanning electron microscopy
- Silicon
- Thermal cycling
- Thermal expansion
- Thin films
- Wetting
- Embedded structures
- Flip chip bonding
- Photolithography sputtering
- Thermal expansion coefficients
- Electronics packaging
Publication and Content Type
- ref (subject category)
- kon (subject category)
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