Process development and reliability for system-in-a-package using liquid crystal polymer substrate

• In this study, embedded chip technology for system-in-a-package (SiP) application using liquid crystal polymer (LCP) substrate was developed and the reliability issue for embedded structure was evaluated. To this end two test chips with daisy chain joints were used with one copper layer. After assembly, modules were exposed to thermal cycling. The failure was investigated by SEM, and compared with finite element method (FEM) simulation results. Passive components as inductors were also fabricated on the LCP during the embedded technology. Their inductance and quality factors were simulated and discussed.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

Computer simulation

Copper

Etching

Finite element method

Inductance

Liquid crystal polymers

Microprocessor chips

Permittivity

Photolithography

Reliability

Scanning electron microscopy

Silicon

Thermal cycling

Thermal expansion

Thin films

Wetting

Embedded structures

Flip chip bonding

Photolithography sputtering

Thermal expansion coefficients

Electronics packaging

Publication and Content Type

ref (subject category)

kon (subject category)