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Investigation of pr...
Investigation of pressure dependent thermal contact resistance between silver metallized SiC chip and DBC substrate
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- Toth-Pal, Zsolt (author)
- Swerea KIMAB, Sweden
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- Zhang, Yafan (author)
- Acreo Swedish ICT, Sweden
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- Belov, Ilja (author)
- Jönköping University,JTH. Forskningsmiljö Material och tillverkning - Ytteknik
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- Nee, Hans-Peter (author)
- KTH,Elkraftteknik
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Bakowski, M. (author)
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(creator_code:org_t)
- Trans Tech Publications Inc. 2015
- 2015
- English.
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In: European Conference on Silicon Carbide and Related Materials, ECSCRM 2014. - : Trans Tech Publications Inc.. - 9783038354789 ; 821-823, s. 452-455
- Related links:
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https://urn.kb.se/re...
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https://doi.org/10.4...
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https://urn.kb.se/re...
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Abstract
Subject headings
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- Thermal contact resistances between a silver metallized SiC chip and a direct bonded copper (DBC) substrate have been measured in a heat transfer experiment. A novel experimental method to separate thermal contact resistances in multilayer heat transfer path has been demonstrated. The experimental results have been compared both with analytical calculations and with 3D computational fluid dynamics (CFD) simulation results. A simplified CFD model of the experimental setup has been validated. The results show significant pressure dependence of the thermal contact resistance but also a pressure independent part.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Maskinteknik -- Strömningsmekanik och akustik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Mechanical Engineering -- Fluid Mechanics and Acoustics (hsv//eng)
Keyword
- DBC substrate
- Heat transfer
- Pressure dependence
- SiC
- Thermal contact resistance
- Computational fluid dynamics
- Contact resistance
- Metallizing
- Silicon carbide
- Silver
- Thermal conductivity of solids
- Analytical calculation
- Computational fluid dynamics simulations
- Direct bonded coppers
- Experimental methods
- Pressure dependent
- Heat resistance
Publication and Content Type
- ref (subject category)
- kon (subject category)
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