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- Liljeholm, Jessica (author)
Through-Glass-Via Enabling Low Loss High-Linearity RF Components
- Article/chapterEnglish2016
Publisher, publication year, extent ...
- 2016
- electronicrdacarrier
Numbers
- LIBRIS-ID:oai:DiVA.org:kth-199961
- https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-199961URI
Supplementary language notes
- Language:English
- Summary in:English
Part of subdatabase
- SwePubSwePub
Classification
Notes
- QC 20170330
- This paper reports on successful fabrication of metal through glass via (TGV) for low-loss high-linearity wafer-level 3D packages (WLP). The DC resistance was characterized to 28mOhm/TGV and the non-linearity of two sets of TGVs with a 1.1 mm long transmission line was better than 78 dBm (IP3).
Subject headings and genre
- TEKNIK OCH TEKNOLOGIER Elektroteknik och elektronik Annan elektroteknik och elektronik hsv//swe
- ENGINEERING AND TECHNOLOGY Electrical Engineering, Electronic Engineering, Information Engineering Other Electrical Engineering, Electronic Engineering, Information Engineering hsv//eng
- MEMS Manufacturing
- WL packaging
- Through Glass Vias (TGV)
- RF TGV
Added entries (persons, corporate bodies, meetings, titles ...)
- Shah, UmerKTH,Mikro- och nanosystemteknik,RF MEMS(Swepub:kth)u14ptvpw (author)
- Campion, JamesKTH,Mikro- och nanosystemteknik,RF MEMS(Swepub:kth)u1p4iubg (author)
- Ebefors, Thorbjörn (author)
- Oberhammer, JoachimKTH,Mikro- och nanosystemteknik,RF MEMS(Swepub:kth)u12600dy (author)
- KTHMikro- och nanosystemteknik (creator_code:org_t)
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- Royal Institute of Technology
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