Search: onr:"swepub:oai:DiVA.org:kth-206153" >
Investigation of a ...
Investigation of a Finned Baseplate Material and Thickness Variation for Thermal Performance of a SiC Power Module
-
- Zhang, Yafan (author)
- RISE,KTH,Elektrisk energiomvandling,Jönköping University, Sweden; KTH Royal Institute of Technology, Sweden,Acreo
-
- Belov, Ilja (author)
- Jönköping University, Sweden
-
- Bakowski, Mietek (author)
- RISE,Acreo
-
show more...
-
- Lim, Jang-Kwon (author)
- RISE,Acreo
-
- Leisner, Peter (author)
- RISE,SP Elektronik
-
- Nee, Hans-Peter (author)
- KTH,Elkraftteknik,KTH Royal Institute of Technology, Sweden
-
show less...
-
(creator_code:org_t)
- IEEE Computer Society, 2014
- 2014
- English.
-
In: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. - : IEEE Computer Society. - 9781479947904
- Related links:
-
https://urn.kb.se/re...
-
show more...
-
https://doi.org/10.1...
-
https://urn.kb.se/re...
-
show less...
Abstract
Subject headings
Close
- A simplified transient computational fluid dynamics model of an automotive three-phase double-side liquid cooled silicon carbide power inverter, including pin-fin baseplates, has been developed and qualified for parametric studies. Effective heat transfer coefficients have been extracted from the detailed pin-fin baseplate model for two coolant volume flow rates 2 l/min and 6 l/min, at the coolant temperature 105 degrees C. The inverter model includes temperature dependent heat losses of SiC transistors and diodes, calculated for two driving cycles. Baseplate materials such as copper, aluminum-silicon carbide metal matrix composite, aluminium alloy 6061 as well as virtual materials have been evaluated in the parametric studies. Thermal conductivity, specific heat and density have been varied as well as thickness of the finned baseplates (1 to 3 mm). A trade-off between temperature of SiC chips and baseplate weight has been investigated by means of Pareto optimization. The main results of the parametric studies include a weak dependence (1 to 3 degrees C) of the chip temperature on baseplate thickness. Furthermore, switching e.g. between copper and AlSiC results in 5 to 8 degrees C increase of the chip temperature, at 65 to 70 % baseplate weight reduction.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Publication and Content Type
- ref (subject category)
- kon (subject category)
Find in a library
To the university's database