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Method for the wafer-level integration of shape memory alloy wires
- Braun, Stefan (author)
-
- Niklaus, Frank (author)
- KTH,Mikro- och nanosystemteknik
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- Fischer, Andreas C. (author)
- KTH,Mikro- och nanosystemteknik
- show more...
- Henrik, Gradin (author)
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- (creator_code:org_t)
- 2013
- English.
- Patent (pop. science, debate, etc.)
Abstract
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- The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.
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- pat (subject category)
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