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Vacancy and interstitial depth profiles in ion-implanted silicon.

Leveque, Patrick (author)
KTH,Mikroelektronik och informationsteknik, IMIT
Kortegaard Nielsen, Hanne (author)
KTH,Mikroelektronik och informationsteknik, IMIT
Pellegrino, Paolo (author)
KTH,Mikroelektronik och informationsteknik, IMIT
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Hallén, Anders. (author)
KTH,Mikroelektronik och informationsteknik, IMIT
Svensson, B. G. (author)
Oslo University
Kuznetsov, A. Y. (author)
Oslo University
Wong-Leung, J. (author)
Australian National University,
Jagadish, C. (author)
Australian National University,
Privitera, V. (author)
CNR-IMM
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 (creator_code:org_t)
AIP Publishing, 2003
2003
English.
In: Journal of Applied Physics. - : AIP Publishing. - 0021-8979 .- 1089-7550. ; 93:2, s. 871-877
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • An experimental method of studying shifts between concentration-versus-depth profiles of vacancy- and interstitial-type defects in ion-implanted silicon is demonstrated. The concept is based on deep level transient spectroscopy measurements utilizing the filling pulse variation technique. The vacancy profile, represented by the vacancy-oxygen center, and the interstitial profile, represented by the interstitial carbon-substitutional carbon pair, are obtained at the same sample temperature by varying the duration of the filling pulse. The effect of the capture in the Debye tail has been extensively studied and taken into account. Thus, the two profiles can be recorded with a high relative depth resolution. Using low doses, point defects have been introduced in lightly doped float zone n-type silicon by implantation with 6.8 MeV boron ions and 680 keV and 1.3 MeV protons at room temperature. The effect of the angle of ion incidence has also been investigated. For all implantation conditions the peak of the interstitial profile is displaced towards larger depths compared to that of the vacancy profile. The amplitude of this displacement increases as the width of the initial point defect distribution increases. This behavior is explained by a simple model where the preferential forward momentum of recoiling silicon atoms and the highly efficient direct recombination of primary point defects are taken into account.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

transient spectroscopy
dopant diffusion
doped silicon
range damage
si
traps
irradiation
capacitance
reduction
defects
Electronics
Elektronik

Publication and Content Type

ref (subject category)
art (subject category)

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