Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Asiatici, Mikhail (author): KTH,Mikro- och nanosystemteknik,Ecole Polytech Fed Lausanne, Sch Comp & Commun Sci, CH-1015 Lausanne, Switzerland.

Ebefors, Thorbjorn (author): Silex Microsyst AB, S-17543 Jarfalla, Sweden.;MyVox AB, S-12938 Hagersten, Sweden.

(creator_code:org_t)

Institute of Electrical and Electronics Engineers (IEEE), 2018
2018
English.
In: IEEE Access. - : Institute of Electrical and Electronics Engineers (IEEE). - 2169-3536. ; 6, s. 44306-44317

Related links:: https://urn.kb.se/re...; show more...; https://doi.org/10.1...; show less...

Abstract Subject headings

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 m Omega, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods.

TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Kommunikationssystem (hsv//swe)
ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Communication Systems (hsv//eng)

By the author/editor: Laakso, Miku J.; Bleiker, Simon J ...; Liljeholm, Jessi ...; Mårtensson, Gust ...; Asiatici, Mikhai ...; Fischer, Andreas ...; show more...; Stemme, Göran, 1 ...; Ebefors, Thorbjo ...; Niklaus, Frank, ...; show less...

About the subject

ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Electrical Engin ...; and Communication Sy ...

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