Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

QC 20180928
A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in glass typically do not have a sufficiently high-quality sidewall profile for super-conformal electroplating of metal into the via holes. To overcome this problem, we demonstrate here that the via holes can instead be filled by magnetically assembling metal wires into them. This method was used to produce TGVs with a typical resistance of 64 m Omega, which is comparable with other metal TGV types reported in the literature. In contrast to many TGV designs with a hollow center, the proposed TGVs can be more area efficient by allowing solder bump placement directly on top of the TGVs, which was demonstrated here using solder-paste jetting. The magnetic assembly process can be parallelized using an assembly robot, which was found to provide an opportunity for increased wafer-scale assembly speed. The aforementioned qualities of the magnetically assembled TGVs allow the realization of glass interposers and MEMS packages in different thicknesses without the drawbacks associated with the current TGV fabrication methods.

TEKNIK OCH TEKNOLOGIER Elektroteknik och elektronik Kommunikationssystem hsv//swe
ENGINEERING AND TECHNOLOGY Electrical Engineering, Electronic Engineering, Information Engineering Communication Systems hsv//eng
Chip scale packaging
femtosecond laser
glass interposer
laser ablation
multichip modules
robotic assembly
self-assembly
spin-on glass
thermal expansion
through-glass via
through-silicon vias
TSV

Bleiker, Simon J.KTH,Mikro- och nanosystemteknik(Swepub:kth)u13ksi31 (author)
Liljeholm, JessicaKTH,Mikro- och nanosystemteknik(Swepub:kth)u1p3t87f (author)
Mårtensson, Gustaf E.Mycronic AB, S-18353 Taby, Sweden. (author)
Asiatici, MikhailKTH,Mikro- och nanosystemteknik,Ecole Polytech Fed Lausanne, Sch Comp & Commun Sci, CH-1015 Lausanne, Switzerland.(Swepub:kth)u1vjcaxo (author)
Fischer, Andreas C.,1982-KTH,Mikro- och nanosystemteknik(Swepub:kth)u1pfkzjx (author)
Stemme, Göran,1958-KTH,Mikro- och nanosystemteknik(Swepub:kth)u1oyebfq (author)
Ebefors, ThorbjornSilex Microsyst AB, S-17543 Jarfalla, Sweden.;MyVox AB, S-12938 Hagersten, Sweden. (author)
Niklaus, Frank,1971-KTH,Mikro- och nanosystemteknik(Swepub:kth)u1bcu8r2 (author)
KTHMikro- och nanosystemteknik (creator_code:org_t)

In:IEEE Access: Institute of Electrical and Electronics Engineers (IEEE)6, s. 44306-443172169-3536

By the author/editor: Laakso, Miku J.; Bleiker, Simon J ...; Liljeholm, Jessi ...; Mårtensson, Gust ...; Asiatici, Mikhai ...; Fischer, Andreas ...; show more...; Stemme, Göran, 1 ...; Ebefors, Thorbjo ...; Niklaus, Frank, ...; show less...

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ENGINEERING AND TECHNOLOGY: ENGINEERING AND ...; and Electrical Engin ...; and Communication Sy ...

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