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LIBRIS Formathandbok  (Information om MARC21)
FältnamnIndikatorerMetadata
00002470naa a2200385 4500
001oai:DiVA.org:kth-29929
003SwePub
008110217s2010 | |||||||||||000 ||eng|
024a https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-299292 URI
024a https://doi.org/10.1016/j.tsf.2009.09.1602 DOI
040 a (SwePub)kth
041 a engb eng
042 9 SwePub
072 7a ref2 swepub-contenttype
072 7a art2 swepub-publicationtype
100a Azarov, Alexanderu KTH,Mikroelektronik och tillämpad fysik, MAP4 aut0 (Swepub:kth)u1us3zzq
2451 0a Dopant incorporation in thin strained Si layers implanted with Sb
264 1b Elsevier BV,c 2010
338 a print2 rdacarrier
500 a QC 20110117 Symposium on Silicon and Germanium Issues for Future CMOS Devices held at the 2009 E-MRS Spring Meeting, Strasbourg, FRANCE, JUN 08-12, 2009
520 a The effect of tensile strain on Sb incorporation in Si and its activation during post-implantation annealing has been Studied by a combination of Rutherford backscattering/channeling spectrometry, secondary ion mass spectrometry. X-ray diffraction and 4-point probe measurements Our results show that, for Sb implanted samples a tensile strain has an important role for dopant behavior Particularly, increasing the tensile strain in the Si layer from 0 to 0 8% leads to an enhancement of the fraction of incorporated Sb atoms in substitutional sites already during implantation from similar to 7 to 30% Furthermore, 0 8% strain in antimony doped Si gives similar to 20% reduction in the sheet resistance in comparison to the unstrained sample.
653 a Strained Si
653 a Ion implantation
653 a Sb incorporation
653 a TECHNOLOGY
653 a TEKNIKVETENSKAP
700a Zamani, Atiehu KTH,Mikroelektronik och tillämpad fysik, MAP4 aut0 (Swepub:kth)u18l4nyo
700a Radamson, Henry H.u KTH,Mikroelektronik och tillämpad fysik, MAP4 aut0 (Swepub:kth)u1g2cqgr
700a Vines, L.4 aut
700a Kuznetsov, A. Yu.4 aut
700a Hallén, Andersu KTH,Mikroelektronik och tillämpad fysik, MAP4 aut0 (Swepub:kth)u11ywmz1
710a KTHb Mikroelektronik och tillämpad fysik, MAP4 org
773t Thin Solid Filmsd : Elsevier BVg 518:9, s. 2474-2477q 518:9<2474-2477x 0040-6090x 1879-2731
8564 8u https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-29929
8564 8u https://doi.org/10.1016/j.tsf.2009.09.160

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