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Inclusion engineeri...
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Wang, WeiKTH,Materialvetenskap,Northeast Elect Power Univ, Dept Chem Engn, Jilin 132012, Jilin, Peoples R China.
(author)
Inclusion engineering in Co-based duplex entropic alloys
- Article/chapterEnglish2021
Publisher, publication year, extent ...
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Elsevier BV,2021
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LIBRIS-ID:oai:DiVA.org:kth-303033
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-303033URI
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https://doi.org/10.1016/j.matdes.2021.110097DOI
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Language:English
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Summary in:English
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Subject category:ref swepub-contenttype
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Subject category:art swepub-publicationtype
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QC 20220309
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Co-based duplex entropic alloy is designed very recently to replace pure Co as a major component of the binder phase for cemented carbide cutting tools. This work aims to provide a fundamental study of oxide inclusion characteristics in the duplex fcc + hcp Co-based entropic alloys. It is found that the Co85-xCrxFe7.5Ni7.5 (x = 15, 30 at.%) alloys hold the highest liquidus (T-liq) and solidus (T-sol) temperatures, compare with the Co85-xCrxMn7.5Ni7.5 (x = 15, 30 at.%) and Co77.5-xCrxFe7.5Mn7.5Ni7.5 (x = 15, 30 at.%) alloys. For each grade, the increasing Cr content leads to a decrease of T-sol and T-liq temperatures. It is also noted that there is an approximate 100 degrees C of undercooling exists in each grade during the solidification. The stable oxide inclusion in the Co85-xCrxMn7.5Ni7.5 and Co77.5-xCrxFe7.5Mn7.5Ni7.5 alloys is the MnCr2O4 type, while Cr2O3 is the main stable inclusion in the Co85-xCrxFe7.5Ni7.5 alloy. Furthermore, the size range of the MnCr2O4 particles is larger than that of Cr2O3. The theoretical calculation shows that MnCr2O4 has a higher coagulation coefficient than Cr2O3 does. This is due to the influence of the thermo-physical parameters, i.e. the interfacial energy between the oxide and the alloy and the viscosity of liquid alloy. The theoretical calculation fits well with the experimental findings.
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Wang, YongKTH,Processer,Hanyang Univ, Dept Mat Sci & Chem Engn, Ansan 15588, South Korea.(Swepub:kth)u1msab4o
(author)
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Mu, Wangzhong,Dr.1985-KTH,Strukturer,Northeastern Univ, Sch Met, Key Lab Electromagnet Proc Mat, Minist Educ, Shenyang 110819, Peoples R China.(Swepub:kth)u1o72emm
(author)
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Park, Joo HyunKTH,Processer,Hanyang Univ, Dept Mat Sci & Chem Engn, Ansan 15588, South Korea.(Swepub:kth)u139gpma
(author)
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Kong, HuiAnhui Univ Technol, Sch Met Engn, Maanshan 243002, Anhui, Peoples R China.
(author)
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Sukenaga, SoheiTohoku Univ, Inst Multidisciplinary Res Adv Mat, Aoba Ku, 2-1-1 Katahira, Sendai, Miyagi 9808577, Japan.
(author)
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Shibata, HiroyukiTohoku Univ, Inst Multidisciplinary Res Adv Mat, Aoba Ku, 2-1-1 Katahira, Sendai, Miyagi 9808577, Japan.
(author)
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Larsson, HenrikKTH,Strukturer,Thermo Calc Software, Råsundav 18, SE-16767 Solna, Sweden.(Swepub:kth)u1z5mmxu
(author)
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Mao, Huahai,1971-KTH,Strukturer,Thermo Calc Software, Råsundav 18, SE-16767 Solna, Sweden.(Swepub:kth)u1v302dc
(author)
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KTHMaterialvetenskap
(creator_code:org_t)
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In:Materials & design: Elsevier BV2100264-12751873-4197
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