Near Volatile and Non-Volatile Memory Processing in 3D Systems

• The cost of transferring data between the off-chip memory system and compute unit is the fundamental energy and performance bottleneck in modern computing systems. Furthermore, with the advent of emerging data-intensive applications and technology scaling, this bottleneck has continuously increased. To overcome these difficulties, Near Memory Processing (NMP) based on 3D die stacking becomes a potential technology to transform the computation-centric system towards memory-centric system. In this work, we explore the feasibility and efficacy of a NMP architecture based on an emerging Non-Volatile Memory technology (NVM) for data-intensive applications and compare it with the conventional 3D-stacked NMP architecture based on DRAM. We demonstrate the effectiveness of our approach with experimental results.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Telekommunikation (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Telecommunications (hsv//eng)

Keyword

3D-Stacked Memory Technologies

Bandwidth

Central Processing Unit

Computer architecture

Data-Intensive Applications

Emerging Non-Volatile Memory Technologies

Memory management

Near Memory Processing

Nonvolatile memory

Random access memory

Three-dimensional displays

Dynamic random access storage

Information management

Memory architecture

Program processors

Three dimensional displays

Three dimensional integrated circuits

3D-stacked memory

3d-stacked memory technology

Data-intensive application

Emerging Non-volatile memory technology

Memory technology

Memory-management

Non-volatile memory

Three-dimensional display

Nonvolatile storage

Publication and Content Type

ref (subject category)

art (subject category)