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  • Unge, MikaelKTH,Polymera material,NKT HV Cables AB, Technol Consulting, SE-72226 Västerås, Sweden. (author)

Hole mobility in amorphous polyethylene - Impact of intra-chain electronic coupling

  • Article/chapterEnglish2023

Publisher, publication year, extent ...

  • Institute of Electrical and Electronics Engineers (IEEE),2023
  • printrdacarrier

Numbers

  • LIBRIS-ID:oai:DiVA.org:kth-344741
  • https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-344741URI
  • https://doi.org/10.1109/CEIDP51414.2023.10410178DOI
  • https://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-50764URI

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  • Language:English
  • Summary in:English

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  • Subject category:ref swepub-contenttype
  • Subject category:kon swepub-publicationtype

Notes

  • QC 20240326
  • Experimental results indicate that electrical conductivity in polyethylene depend on the morphology. In order to simulate mobility in polyethylene the morphology need to be included implicitly or explicitly. To include the morphology explicitly in atomic scale simulation of mobility the charge transport along the chain need to described. Marcus theory can be used to describe the hopping process. Here a ghost atom model was used to calculate electronic coupling both along and between chains. A factor 10 difference was seen between intra-chain electronic coupling obtained here compared to previous results. However, the charge transport in amorphous polyethylene was primarily limited by the inter-chain electronic coupling.

Subject headings and genre

Added entries (persons, corporate bodies, meetings, titles ...)

  • Aspaker, HannesNKT HV Cables AB, Technol Consulting, SE-72226 Västerås, Sweden. (author)
  • Nilsson, Fritjof,Docent,1978-Mittuniversitetet,KTH,Polymera material,Mid Sweden Univ, FSCN Res Ctr, S-85170 Sundsvall, Sweden.,Institutionen för ingenjörsvetenskap, matematik och ämnesdidaktik (2023-)(Swepub:miun)frinil2200 (author)
  • Hedenqvist, Mikael S.KTH,Polymera material(Swepub:kth)u10rkaxe (author)
  • KTHPolymera material (creator_code:org_t)

Related titles

  • In:2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2023: Institute of Electrical and Electronics Engineers (IEEE)9798350335620

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