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  • Carlborg, Carl Fredrik,1981-KTH,Mikrosystemteknik (author)

LOW TEMPERATURE “CLICK” WAFER BONDING OF OFF-STOICHIOMETRY THIOL-ENE (OSTE) POLYMERS TO SILICON

  • Article/chapterEnglish2011

Publisher, publication year, extent ...

  • 2011
  • electronicrdacarrier

Numbers

  • LIBRIS-ID:oai:DiVA.org:kth-49436
  • https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-49436URI

Supplementary language notes

  • Language:English
  • Summary in:English

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  • Subject category:ref swepub-contenttype
  • Subject category:kon swepub-publicationtype

Notes

  • QC 20111130
  • We present a low temperature (< 37°C) wafer-scale microfluidic batch packaging process using covalent, dry bonding of offstoichiometry thiol-ene polymers (OSTE), enabling rapid, bio-compatible integration of fluidics on wafer-scale in combination with excellent polymer properties.

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  • Saharil, FarizahKTH,Mikrosystemteknik(Swepub:kth)u1481q3i (author)
  • Haraldsson, TommyKTH,Mikrosystemteknik(Swepub:kth)u1ohdrr6 (author)
  • Wijngaart, Wouter van derKTH,Mikrosystemteknik(Swepub:kth)u1wdbont (author)
  • KTHMikrosystemteknik (creator_code:org_t)

Related titles

  • In:15th International Conference on Miniaturized Systems for Chemistry and Life Sciences (microTAS 2011), s. 1143-11459781618395955

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