Detailed CFD modelling of EMC screen for radio base stations: a parametric study

Anton Remirez, RaulHögskolan i Gävle,KTH,Energiteknik,Ämnesavdelningen för energi- och maskinteknik,Department of Mechanical Engineering, TECNUN, University of Navarra, Navarra, Spain; Division of Applied Thermodynamics and Refrigeration, KTH Energy Technology, Royal Institute of Technology, Stockholm, Sweden (author)

Detailed CFD modelling of EMC screen for radio base stations : a parametric study

QC 20100630. Uppdaterad från Submitted till Published (20100908)
The objective of this paper is to make a parametric study of the hydraulic resistance and flow pattern of the flow after an electromagnetic compatibility screen and between two printed circuit boards (PCBs) in a model of a 90° subrack cooling architecture. The parametric study is carried out using a detailed 3-D model of a PCB slot. The detailed model was experimentally validated in a previous paper by the authors. Seven parameters were investigated: velocity, inlet height, screen porosity, PCB thickness, distance between two PCBs, inlet-screen gap and screen thickness. A correlation for the static anddynamic pressure drop, the percentage of dimensionless wetted area, Aw*, and the RMS* factor (a function of the flow uniformity along the PCB) after the screen is reported as a function of six geometrical dimensionless parameters and the Reynolds number. The correlations, that are based on 174 three dimensional simulations, yield good results for the total pressure drop, in which the values are predicted within the interval of ±15%. For the, Aw* all the predicted values are within the interval of ±22% of the observed values. Finally, for the RMS* factor, the majority of the values also have a disagreement of less than 20% of the observed values. These last two parameters are believed to provide a correct insight about the flow pattern after the screen.

Jonsson, HansHögskolan i Gävle,KTH,Energiteknik,Ämnesavdelningen för energi- och maskinteknik,Division of Applied Thermodynamics and Refrigeration, KTH Energy Technology, Royal Institute of Technology, Stockholm, Sweden(Swepub:hig)hjo (author)
Moshfegh, BahramHögskolan i Gävle,Ämnesavdelningen för energi- och maskinteknik(Swepub:hig)bmh (author)
KTHEnergiteknik (creator_code:org_t)

In:IEEE transactions on components and packaging technologies32:1, s. 145-1551521-33311557-9972

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