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Very compact FTTH D...
Very compact FTTH Diplexer design using advanced wafer level fabrication methods
- Article/chapterEnglish2008
Publisher, publication year, extent ...
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Strasbourg :SPIE,2008
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printrdacarrier
Numbers
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LIBRIS-ID:oai:DiVA.org:kth-82997
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https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-82997URI
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https://doi.org/10.1117/12.779746DOI
Supplementary language notes
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Language:English
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Summary in:English
Part of subdatabase
Classification
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Subject category:ref swepub-contenttype
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Subject category:kon swepub-publicationtype
Notes
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QC 20120301
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FTTH networks require implementing a diplexer at each user termination. According to most of the standards, this diplexer detects a download signal beam at 1.49ÎŒm and emits an upload signal beam at 1.31ÎŒm on the same single mode fibre. Both signals exhibit datarate speed below 2.5Gbps. Today, most of the diplexers are obtained by actively aligning a set of individual optoelectronic components and micro-optics. However, new manufacturing solutions satisfying very low cost and mass production capability requirements of this market would help to speed the massive spreading of this technology. In this paper, we present an original packaging design to manufacture Diplexer Optical Sub-Assembly for FTTH application. A dual photodiode is stacked over a VCSEL and detects both the download signal beam at 1.49ÎŒm passing through the laser and one part of the upload signal beam at 1.31ÎŒm for monitoring. To satisfy this approach, an innovative VCSEL has been designed to have a very high transmission at 1.49ÎŒm. All these components are mounted on a very small circuit board on glass including also integrated circuits such as transimpedance amplifier. So, the device combines advanced optoelectronic components and highly integrated Multi-Chip-Module on glass approach using collective wafer-level assembling technologies. For the single mode fibre optical coupling, active and passive alignment solutions are considered.
Subject headings and genre
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NATURVETENSKAP Fysik Den kondenserade materiens fysik hsv//swe
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NATURAL SCIENCES Physical Sciences Condensed Matter Physics hsv//eng
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Diplexer
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FTTH
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Optical interconnects
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Packaging
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VCSEL
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Amplifiers (electronic)
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Architectural design
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Chip scale packages
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Computer networks
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Differential amplifiers
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Electronic equipment manufacture
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Electronics industry
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Glass
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Integrated circuits
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Manufacture
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Metropolitan area networks
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Microelectronics
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Network protocols
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Networks (circuits)
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Optical design
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Optics
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Pulsed laser deposition
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Single mode fibers
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Standards
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Surface emitting lasers
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Technology
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(OTDR) technology
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Diplexers
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Fiber-to-the-home (FTTH) application
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Filber-to-the-home (FTTH) networks
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High transmission
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Highly integrated
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Individual (PSS 544-7)
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Low costs
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Manufacturing solutions
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Mass production
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Micro-optics
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Multi chip module (MCM)
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Optical couplings
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Optical Sub-Assembly (OSA)
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Optoelectronic components
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Packaging designs
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Passive alignment
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Signal beams
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Single mode fibres
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Trans-impedance amplifier (TIA)
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Wafer level fabrication
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Wafer levels
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Multiplexing equipment
Added entries (persons, corporate bodies, meetings, titles ...)
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Grosse, P.
(author)
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Gilet, P.
(author)
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Olivier, N.
(author)
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Chelnokov, A.
(author)
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Fulbert, L.
(author)
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Bernabé, S.
(author)
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Rossat, C.
(author)
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Hamelin, R.
(author)
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Hamberg, I.
(author)
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Lundqvist, L.
(author)
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Chitica, N.
(author)
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Hammar, M.
(author)
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Berggren, Jesper
(author)
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Junique, S.
(author)
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Wang, Q.
(author)
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Almqvist, S.
(author)
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Sillans, C.
(author)
Related titles
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In:MICRO-OPTICS 2008Strasbourg : SPIE
Internet link
To the university's database
- By the author/editor
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Kopp, C.
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Grosse, P.
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Gilet, P.
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Olivier, N.
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Chelnokov, A.
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Fulbert, L.
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show more...
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Bernabé, S.
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Rossat, C.
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Hamelin, R.
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Hamberg, I.
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Lundqvist, L.
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Chitica, N.
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Hammar, M.
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Berggren, Jesper
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Junique, S.
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Wang, Q.
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Almqvist, S.
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Sillans, C.
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show less...
- About the subject
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- NATURAL SCIENCES
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NATURAL SCIENCES
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and Physical Science ...
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and Condensed Matter ...
- Articles in the publication
- MICRO-OPTICS 200 ...
- By the university
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Royal Institute of Technology