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Low temperature co-fired ceramic package for lab-on-CMOS applied in cell viability monitoring

Halonen, Niina (author)
Microelectronics and Material Physics Laboratories, University of Oulu, Finland
Kilpijärvi, Joni (author)
Microelectronics and Material Physics Laboratories, University of Oulu, Finland
Sobocinski, Maciej (author)
Microelectronics and Material Physics Laboratories, University of Oulu, Finland
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Datta-Chaudhuri, Timir (author)
Laboratory for MicroTechnologies, Department of Mechanical Engineering and the Institute for Systems Research ,University of Maryland, Baltimore, USA
Hassinen, Antti (author)
Division of Cell Biology, Department of Biochemistry, University of Oulu, Finland
Prakash, S. B. (author)
Integrated Biomorphic Information System Laboratory, University of Maryland, Baltimore, USA
Möller, Peter (author)
Linköpings universitet,Tillämpad sensorvetenskap,Tekniska fakulteten
Abshire, Pamela (author)
Integrated Biomorphic Information System Laboratory, University of Maryland, Baltimore, USA
Smela, Elisabeth (author)
Laboratory for MicroTechnologies, Department of Mechanical Engineering and the Institute for Systems Research, University of Maryland, Baltimore, USA
Kellokumpu, Sakari (author)
Division of Cell Biology, Department of Biochemistry, University of Oulu, Finland
Lloyd Spetz, Anita (author)
Linköpings universitet,Tillämpad sensorvetenskap,Tekniska fakulteten,Univ Oulu, Oulu, Finland
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 (creator_code:org_t)
Elsevier BV, 2015
2015
English.
In: Eurosensors 2015. - : Elsevier BV. ; , s. 1079-1082
  • Conference paper (peer-reviewed)
Abstract Subject headings
Close  
  • Lab-on-CMOS chips (LOCMOS) are sophisticated miniaturized analysis tools based on integrated circuit (IC) microchips performing various laboratory functions. We have developed a low temperature co-fired ceramic (LTCC) package for a LOCMOS application regarding cytotoxicity assessment of nanomaterials. The LTCC packaged capacitance sensor chip is designed for long-term cell viability monitoring during nanoparticle exposure. The introduced LTCC package utilizes the flip chip bonding technique, and it is biocompatible as well as able to withstand the environmental conditions required to maintain mammalian cell culture directly on the surface of a complementary metal oxide semiconductor (CMOS) integrated circuit.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
NATURVETENSKAP  -- Fysik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences (hsv//eng)

Keyword

Lab-on-CMOS;low temperature co-fired ceramics;electronics packaging;cytotoxicity assesment;capacitance sensing

Publication and Content Type

ref (subject category)
kon (subject category)

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