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  • Asplund, MariaNeuronic Engineering, School of Technology and Health, Royal Institute of Technology, Alfred Nobels Allé 10, 146 57 Huddinge, Stockholm, Sweden (author)

Construction of wire electrodesand 3D woven logicas a potential technology forneuroprosthetic implants

  • Article/chapterEnglish2008

Publisher, publication year, extent ...

  • 2008
  • printrdacarrier

Numbers

  • LIBRIS-ID:oai:DiVA.org:liu-20804
  • https://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-20804URI

Supplementary language notes

  • Language:English
  • Summary in:English

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Classification

  • Subject category:vet swepub-contenttype
  • Subject category:art swepub-publicationtype

Notes

  • New strategies to improve neuron coupling to neuroelectronic implants are needed. In particular, tomaintain functional coupling between implant and neurons, foreign body response like encapsulation must meminimized. Apart from modifying materials to mitigate encapsulation it has been shown that with extremely thinstructures, encapsulation will be less pronounced. We here utilize wire electrochemical transistors (WECTs) usingconducting polymer coated fibers. Monofilaments down to 10 μm can be successfully coated and weaved intocomplex networks with built in logic functions, so called textile logic. Such systems can control signal patterns at alarge number of electrode terminals from a few addressing fibres. Not only is fibre size in the range where lessencapsulation is expected but textiles are known to make successful implants because of their soft and flexiblemechanical properties. Further, textile fabrication provides versatility and even three dimensional networks arepossible. Three possible architectures for neuroelectronic systems are discussed. WECTs are sensitive to dehydrationand materials for better durability or improved encapsulation is needed for stable performance in biologicalenvironments.

Subject headings and genre

  • Conducting polymers
  • functional electrical stimulation
  • textile electronics
  • TECHNOLOGY
  • TEKNIKVETENSKAP

Added entries (persons, corporate bodies, meetings, titles ...)

  • Hamedi, MahiarLinköpings universitet,Biomolekylär och Organisk Elektronik,Tekniska högskolan(Swepub:liu)mahha75 (author)
  • Forchheimer, RobertLinköpings universitet,Bildkodning,Tekniska högskolan(Swepub:liu)robfo65 (author)
  • Inganäs, OlleLinköpings universitet,Biomolekylär och Organisk Elektronik,Tekniska högskolan(Swepub:liu)ollin59 (author)
  • Holst, Hans vonNeuronic Engineering, School of Technology and Health, Royal Institute of Technology, Alfred Nobels Allé 10, 146 57 Huddinge, Stockholm, Sweden/Division of Clinical Neuroscience, Section Neurosurgery, Karolinska Institutet, Stockholm, Sweden (author)
  • Neuronic Engineering, School of Technology and Health, Royal Institute of Technology, Alfred Nobels Allé 10, 146 57 Huddinge, Stockholm, SwedenBiomolekylär och Organisk Elektronik (creator_code:org_t)

Related titles

  • In:IEEE Transactions on Biomedical Engineering0018-92941558-2531

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