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  • Palisaitis, Justinas,1983-Linköpings universitet,Tekniska högskolan,Tunnfilmsfysik (author)

Two Dimensional X-ray Diffraction Mapping of Basal Plane Orientation on SiC Substrates

  • Article/chapterEnglish2009

Publisher, publication year, extent ...

  • Materials Science Forum Vols. 615-617 :Trans Tech Publications,2009
  • printrdacarrier

Numbers

  • LIBRIS-ID:oai:DiVA.org:liu-43532
  • https://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-43532URI
  • https://doi.org/10.4028/www.scientific.net/MSF.615-617.275DOI

Supplementary language notes

  • Language:English
  • Summary in:English

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  • Subject category:ref swepub-contenttype
  • Subject category:kon swepub-publicationtype

Notes

  • We have performed 2D X-ray diffraction mapping of the SiC lattice basal plane orientation over full 2” SiC substrates. Measurements of the omega angle were made in two perpendicular directions <11-20> and <1-100>, which gives the complete vectorized tilt of the basal planes. The Mapping revealed two characteristic bending behaviors on measured commercial wafers. The first is characterized by large variations in omega angle across the wafer in both crystallographic directions. The continuously changing omega angle in both directions gives the wafer an apparent rotationally symmetric bending which is concave towards the growth direction. The second characteristic behavior is seen in wafers with lower degree of omega angle variation. The variations in this type of wafers are not changing linearly, but are bending the basal planes with two-fold symmetry.

Subject headings and genre

  • NATURAL SCIENCES
  • NATURVETENSKAP

Added entries (persons, corporate bodies, meetings, titles ...)

  • Bergman, Peder,1961-Linköpings universitet,Tekniska högskolan,Halvledarmaterial(Swepub:liu)pedbe86 (author)
  • Persson, Per,1971-Linköpings universitet,Tekniska högskolan,Tunnfilmsfysik(Swepub:liu)perpe25 (author)
  • Linköpings universitetTekniska högskolan (creator_code:org_t)

Related titles

  • In:ECSCRM2008,2009Materials Science Forum Vols. 615-617 : Trans Tech Publications, s. 275-2789780878493340

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