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Scanning spreading resistance microscopy of aluminum implanted 4H-SiC

Osterman, J. (author)
Department of Microelectronics, Royal Institute of Technology, PO Box Electrum 229, S 164 40 Kista, Sweden
Abtin, L. (author)
Department of Microelectronics, Royal Institute of Technology, PO Box Electrum 229, S 164 40 Kista, Sweden
Zimmermann, U. (author)
Department of Microelectronics, Royal Institute of Technology, PO Box Electrum 229, S 164 40 Kista, Sweden
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Janson, M.S. (author)
Department of Microelectronics, Royal Institute of Technology, PO Box Electrum 229, S 164 40 Kista, Sweden
Anand, Srinivasan (author)
KTH,Mikroelektronik och informationsteknik, IMIT,Department of Microelectronics, Royal Institute of Technology, PO Box Electrum 229, S 164 40 Kista, Sweden
Hallin, Christer (author)
Linköpings universitet,Tekniska högskolan,Institutionen för fysik, kemi och biologi
Hallén, Anders (author)
KTH,Mikroelektronik och informationsteknik, IMIT,Hallén, A., Department of Microelectronics, Royal Institute of Technology, PO Box Electrum 229, S 164 40 Kista, Sweden
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 (creator_code:org_t)
2003
2003
English.
In: Materials Science & Engineering. - 0921-5107 .- 1873-4944. ; 102:1-3, s. 128-131
  • Conference paper (other academic/artistic)
Abstract Subject headings
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  • Results from the application of scanning spreading resistance microscopy (SSRM) for characterization of aluminum implanted 4H-SiC are presented. The implanted profiles are investigated electrically and morphologically as a function of post-implantation anneal conditions. The method is shown to be advantageous for measuring and optimizing the activation in many aspects with respect to existing alternative techniques: it provides information of the entire depth and Al concentration range, it is unaffected by annealing induced re-growth and/or surface roughening, and requires little sample preparation. The results indicate that the apparent activation and surface roughness do not saturate in the investigated temperature range of 1500-1650 °C. Finally, an apparent activation energy for the process of 3 eV is estimated. © 2003 Elsevier B.V. All rights reserved.

Keyword

Activation
Implantation
Silicon carbide
SSRM
TECHNOLOGY
TEKNIKVETENSKAP

Publication and Content Type

vet (subject category)
kon (subject category)

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