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ORMOCER (R) S - Inorganic-organic hybrid materials for e/o-interconnection-technology

Popall, M (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
Dabek, A (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
Robertsson, ME (author)
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Valizadeh, S (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
Hagel, OJ (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
Buestrich, R (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
Nagel, R (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
Cergel, L (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
Lambert, D (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
Schaub, M (author)
Fraunhofer Inst Silicatforshung, D-97082 Wurzburg, Germany Tech Univ Berlin, D-13355 Berlin, Germany Ericsson Components AB, S-16481 Stockholm, Sweden IMC Microsyst, S-58330 Linkoping, Sweden Motorola SPS, CH-1218 Geneva, Switzerland BULL, VLSI Packaging, F-78340 Les Clayes Bois, France WC Heraeus, D-63450 Hanau, Germany
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 (creator_code:org_t)
2000
2000
English.
In: Molecular Crystals and Liquid Crystals Science and Technology. - 1058-725X. ; 354, s. 711-730
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • Hybrid inorganic-organic polymers (ORMOCER (R)s) have been developed and tested for evaluation in optical and electrical interconnection technology. The photopatternable materials with negative resist behaviour are composed of inorganic oxidic structures cross-linked or substituted by organic groups. They are prepared from organosilane precursors by sol-gel-processing in combination with organic crosslinking of polymerizable organic Functions, As a result of these functionalities the properties of the ORMOCER (R)s can be adjusted to particular applications. Systematic variation of composition combined with adaptation to micro system technology allows great flexibility in processing. The main features of these materials are: Combined use as dielectric and passivation layers in electrical systems and devices as well as core and cladding for optical applications enables e/o applications with high integration levels, Postbaking at moderate temperatures (120 degreesC - 170 degreesC) enables processing on low-cost substrates such as FR-4 and BT. Easily adaptable to thin film technology: spin-on with planarisation >90% and via diameters down to 20 mum have been achieved.

Keyword

ORMOCER (R)
inorganic-organic polymer
dielectric
optical waveguide
e/o-applications
SBU-layers on advanced PCB
NATURAL SCIENCES
NATURVETENSKAP

Publication and Content Type

ref (subject category)
art (subject category)

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