Fabrication of silicon nitride/oxynitride by reaction bonding and post sintering

• Reaction bonding and post sintering of silicon nitride/oxynitride was investigated as a route to fabricate a material with good oxidation resistance and good high temperature strength. Silicon powders, mixed with 0, 2, 4, 8 and 16 wt% silica, were CIPed at 150 MPa and nitrided using the nitrogen demand principle. Four different nitriding gas compositions were used, consisting of different amounts of hydrogen, argon and helium mixed with nitrogen. Post sintering at atmospheric pressure and by HIP at 160 MPa were investigated to densify the materials. Samples were characterised by XRD, SEM and Hg-porosimetry in both the nitrided and sintered state

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Annan materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Other Materials Engineering (hsv//eng)

Keyword

Materialteknik

Engineering Materials

Publication and Content Type

ref (subject category)

kon (subject category)