Proficiency testing for conducted immunity with a new round robin test device

References: Tas, E., Pythoud, F., A new conducted immunity test device for interlaboratory comparisons (2015) IEEE International Symposium on Electromagnetic Compatibility and EMC Europe; (2005) ISO/IEC 17025: General Requirements for the Competence of Testing and Calibration Laboratories, , 2nd Edition; (2010) ISO/IEC 17043: Conformity Assesment-General Requirements for Proficiency Testing, , 1st Edition; Goedbloed, J.J., Beeckman, P.A., Uncertainty of the CISPR/A radiated emission round-robin test results (2004) IEEE Transactions on Electromagnetic Compatibility, 46 (2). , May; (2013) IEC 61000-4-6 Electromagnetic Compatibility (EMC)-Part 4-6: Testing and Measurement Techniques-Immunity to Conducted Disturbances, Induced by Radio-frequency Fields, , 4th Edition, IEC
Last year, a new round robin test device was proposed for inter-laboratory comparisons in conducted immunity testing according to IEC 61000-4-6[1]. The device has recently been successfully evaluated among all EMRP Project partners. The device is able to confirm or to deny the testing capability of a laboratory by recording a full set of parameters. The device is now ready for deployment as the first commercial proficiency testing device for conducted immunity.

TEKNIK OCH TEKNOLOGIER Elektroteknik och elektronik Annan elektroteknik och elektronik hsv//swe
ENGINEERING AND TECHNOLOGY Electrical Engineering, Electronic Engineering, Information Engineering Other Electrical Engineering, Electronic Engineering, Information Engineering hsv//eng
Auxiliary Equipment (AE)
common mode
conducted immunity
Coupling-Decoupling Network (CDN)
disturbance signal
Electromagnetic Compatibility (EMC)
EN ISO 17025
EN ISO 17043
Equipment under Test (EUT)
IEC 61000-4-6
inter-laboratory comparison
proficiency testing
round robin
test device
Auxiliary equipment
Equipment testing
Routers
Superconducting tapes
Decoupling network
Disturbance signals
Equipment under tests
Interlaboratory comparison
ISO 17025
Electromagnetic compatibility

Cakir, S.TÜBİTAK UME National Metrology Institute, Turkey (author)
Cetintas, M.TÜBİTAK UME National Metrology Institute, Turkey (author)
Hamouz, P.CMI Czech Metrology Institute, Czech Republic (author)
Isbring, T.RISE,EMC (author)
Kokalj, M.SIQ Slovenian Institute of Quality and Metrology, Slovenia (author)
Lopez, D.INTA National Institute of Aerospace Technology, Spain (author)
Lundgren, U.RISE,EMC (author)
Mandaris, D.University of Twente, Netherlands; LIPI Indonesian Institute of Sciences, Indonesia (author)
Pinter, B.SIQ Slovenian Institute of Quality and Metrology, Slovenia (author)
Poriz, M.CMI Czech Metrology Institute, Czech Republic (author)
Pous, M.Polytechnic University of Catalonia, Spain (author)
Pythoud, F.METAS Federal Institute of Metrology, Switzerland (author)
Sen, O.TÜBİTAK UME National Metrology Institute, Turkey (author)
Silva, F.Polytechnic University of Catalonia, Spain (author)
Svoboda, M.CMI Czech Metrology Institute, Czech Republic (author)
Trincaz, B.LNE Laboratoire national de métrologie et d'essais, France (author)
Zhao, D.VSL Dutch Metrology Institute, Netherlands (author)
METAS Federal Institute of Metrology, SwitzerlandTÜBİTAK UME National Metrology Institute, Turkey (creator_code:org_t)

In:2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, s. 274-2799781509014163

By the author/editor: Tas, E.; Cakir, S.; Cetintas, M.; Hamouz, P.; Isbring, T.; Kokalj, M.; show more...; Lopez, D.; Lundgren, U.; Mandaris, D.; Pinter, B.; Poriz, M.; Pous, M.; Pythoud, F.; Sen, O.; Silva, F.; Svoboda, M.; Trincaz, B.; Zhao, D.; show less...

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