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Proficiency testing...
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Tas, E.METAS Federal Institute of Metrology, Switzerland
(author)
Proficiency testing for conducted immunity with a new round robin test device
- Article/chapterEnglish2016
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LIBRIS-ID:oai:DiVA.org:ri-27589
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https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-27589URI
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https://doi.org/10.1109/EMCEurope.2016.7739174DOI
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Language:English
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Summary in:English
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Subject category:ref swepub-contenttype
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Subject category:kon swepub-publicationtype
Notes
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References: Tas, E., Pythoud, F., A new conducted immunity test device for interlaboratory comparisons (2015) IEEE International Symposium on Electromagnetic Compatibility and EMC Europe; (2005) ISO/IEC 17025: General Requirements for the Competence of Testing and Calibration Laboratories, , 2nd Edition; (2010) ISO/IEC 17043: Conformity Assesment-General Requirements for Proficiency Testing, , 1st Edition; Goedbloed, J.J., Beeckman, P.A., Uncertainty of the CISPR/A radiated emission round-robin test results (2004) IEEE Transactions on Electromagnetic Compatibility, 46 (2). , May; (2013) IEC 61000-4-6 Electromagnetic Compatibility (EMC)-Part 4-6: Testing and Measurement Techniques-Immunity to Conducted Disturbances, Induced by Radio-frequency Fields, , 4th Edition, IEC
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Last year, a new round robin test device was proposed for inter-laboratory comparisons in conducted immunity testing according to IEC 61000-4-6[1]. The device has recently been successfully evaluated among all EMRP Project partners. The device is able to confirm or to deny the testing capability of a laboratory by recording a full set of parameters. The device is now ready for deployment as the first commercial proficiency testing device for conducted immunity.
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Cakir, S.TÜBİTAK UME National Metrology Institute, Turkey
(author)
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Cetintas, M.TÜBİTAK UME National Metrology Institute, Turkey
(author)
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Hamouz, P.CMI Czech Metrology Institute, Czech Republic
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Isbring, T.RISE,EMC
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Kokalj, M.SIQ Slovenian Institute of Quality and Metrology, Slovenia
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Lopez, D.INTA National Institute of Aerospace Technology, Spain
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Lundgren, U.RISE,EMC
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Mandaris, D.University of Twente, Netherlands; LIPI Indonesian Institute of Sciences, Indonesia
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Pinter, B.SIQ Slovenian Institute of Quality and Metrology, Slovenia
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Poriz, M.CMI Czech Metrology Institute, Czech Republic
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Pous, M.Polytechnic University of Catalonia, Spain
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Pythoud, F.METAS Federal Institute of Metrology, Switzerland
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Sen, O.TÜBİTAK UME National Metrology Institute, Turkey
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Silva, F.Polytechnic University of Catalonia, Spain
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Svoboda, M.CMI Czech Metrology Institute, Czech Republic
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Trincaz, B.LNE Laboratoire national de métrologie et d'essais, France
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Zhao, D.VSL Dutch Metrology Institute, Netherlands
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METAS Federal Institute of Metrology, SwitzerlandTÜBİTAK UME National Metrology Institute, Turkey
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In:2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE, s. 274-2799781509014163
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Tas, E.
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Cakir, S.
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Cetintas, M.
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Hamouz, P.
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Isbring, T.
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Kokalj, M.
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Lopez, D.
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Lundgren, U.
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Mandaris, D.
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Pinter, B.
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Poriz, M.
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Pous, M.
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Pythoud, F.
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Sen, O.
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Silva, F.
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Svoboda, M.
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Trincaz, B.
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Zhao, D.
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