Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to ElectrolessNickel/Immersion Gold

• Solder joints to solder lands plated with electroless nickel and immersion gold are prone to fractures in the interface between the solder and the nickel surface. A common cause for these fractures has been a plating defect in the solder land coating called “black pad”. However, solder joints to solder lands plated with electroless nickel are inclined to fractures even if the black pad defect is not present. The causes of the black pad defect and the mechanisms for the increased inclination for fractures in solder joints to electroless nickel are discussed. Test methods for detecting black pad defects and assessing the risk for fractures in the solder joints are also described.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Publication and Content Type

ref (subject category)

kap (subject category)