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Browsing the Real W...
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Berggren, MagnusLinköpings universitet,Fysik och elektroteknik,Tekniska fakulteten
(author)
Browsing the Real World using Organic Electronics, Si-Chips, and a Human Touch
- Article/chapterEnglish2016
Publisher, publication year, extent ...
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2016-01-07
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Wiley,2016
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electronicrdacarrier
Numbers
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LIBRIS-ID:oai:DiVA.org:ri-32597
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https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-32597URI
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https://doi.org/10.1002/adma.201504301DOI
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https://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-125994URI
Supplementary language notes
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Language:English
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Summary in:English
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Classification
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Subject category:ref swepub-contenttype
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Subject category:art swepub-publicationtype
Notes
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Funding details: Knut och Alice Wallenbergs Stiftelse; Funding details: VINNOVA
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Funding agencies: Knut and Alice Wallenberg Foundation; Onnesjo Foundation; VINNOVA; Swedish Foundation for Strategic Research
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Two different e-labels were developed to explore the feasibility and to identify scientifi c and engineering challenges of the Real-World-Web platform. First was a printed biosensor e-label, comprising Si-chips with an array of different printegrated devices, and second, an e-label to explore the feasibility of transferring data, through the human body, between a mobile device and different distributed e-labels, adhered onto the body or onto dedicated devices and surfaces of one's ambience. The silicon chips utilized in e-labels, include analogue and digital circuitry to receive and handle sensory input, to perform signal processing, and to transmit information to antennas and displays. When used, the e-label is turned on, and a sample is then added onto the sensor area. The display provides simple instructions and updated information to the user. All data handling, electrical probing, and analysis of the sensor is performed by the Si-chips, and the sensing data is finally shown in the printed display. The second e-label exemplifies an ID-tag for body area networks (BAN) communication applications, which, in part, is manufactured and integrated in the same way as the first e-label, but with another choice of Si-chips and capacitive antennas.
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Simon, DanielLinköpings universitet,Fysik och elektroteknik,Tekniska fakulteten(Swepub:liu)dansi08
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Nilsson, DavidRISE,Smart hårdvara,Acreo Swedish ICT, Box 787, SE-601 17, Norrköping, Sweden.(Swepub:ri)davidni@ri.se
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Dyreklev, PeterRISE,Acreo,Acreo Swedish ICT, Box 787, SE-601 17, Norrköping, Sweden.
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Norberg, PetronellaRISE,Acreo,Acreo Swedish ICT, Box 787, SE-601 17, Norrköping, Sweden.(Swepub:ri)petronella.norberg@ri.se
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Nordlinder, StaffanRISE,Acreo,Acreo Swedish ICT, Box 787, SE-601 17, Norrköping, Sweden.
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Andersson Ersman, PeterRISE,Acreo,Acreo Swedish ICT, Box 787, SE-601 17, Norrköping, Sweden.(Swepub:ri)PeterAn@ri.se
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Gustafsson, GöranRISE,Acreo,Acreo Swedish ICT, Box 787, SE-601 17, Norrköping, Sweden.
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Wikner, JacobLinköpings universitet,Elektroniska Kretsar och System,Tekniska fakulteten(Swepub:liu)jacwi50
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Hederen, JanDU Radio, Ericsson AB, SE-583 30, Linköping, Sweden.
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Hentzell, HansRISE,Acreo,Swedish ICT Research, Box 1151, SE-164 26, Kista, Sweden.
(author)
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Linköpings universitetFysik och elektroteknik
(creator_code:org_t)
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In:Advanced Materials: Wiley28:10, s. 1911-19160935-96481521-4095
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Berggren, Magnus
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Simon, Daniel
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