CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-d integration

Forsberg, Fredrik (author): KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden

Roxhed, Niclas (author): KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden

Ericsson, Per (author)

(creator_code:org_t)

Institute of Electrical and Electronics Engineers Inc. 2015
2015
English.
In: IEEE Journal of Selected Topics in Quantum Electronics. - : Institute of Electrical and Electronics Engineers Inc.. - 0792-1233 .- 1077-260X .- 1558-4542. ; 21:4

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Abstract Subject headings

We demonstrate infrared focal plane arrays utilizing monocrystalline silicon/silicon-germanium (Si/SiGe) quantum-well microbolometers that are heterogeneously integrated on top of CMOS-based electronic read-out integrated circuit substrates. The microbolometers are designed to detect light in the long wavelength infrared (LWIR) range from 8 to 14 μm and are arranged in focal plane arrays consisting of 384 × 288 microbolometer pixels with a pixel pitch of 25 μm × 25 μm. Focal plane arrays with two different microbolometer designs have been implemented. The first is a conventional single-layer microbolometer design and the second is an umbrella design in which the microbolometer legs are placed underneath the microbolometer membrane to achieve an improved pixel fill-factor. The infrared focal plane arrays are vacuum packaged using a CMOS compatible wafer bonding and sealing process. The demonstrated heterogeneous 3-D integration and packaging processes are implemented at wafer-level and enable independent optimization of the CMOS-based integrated circuits and the microbolometer materials. All manufacturing is done using standard semiconductor and MEMS processes, thus offering a generic approach for integrating CMOS-electronics with complex miniaturized transducer elements

By the author/editor: Forsberg, Fredri ...; Lapadatu, A.; Kittilsland, G.; Martinsen, S.; Roxhed, Niclas; Fischer, A. C.; show more...; Stemme, G.; Samel, Björn; Ericsson, Peter; Hoivik, N.; Bakke, T.; Bring, M.; Kvisteroy, T.; Ror, A.; Niklaus, Frank; Ericsson, Per; show less...

About the subject

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