Flexible Circuits Based on Aluminum Conductor and Nonwoven Substrate

• Electronic textiles, integrating functional electronics circuits into fabric materials, are emerging as an important branch of flexible circuits. In this paper, we introduce a novel material combination for electronic textiles that can be used in implementing hybrid electronics. This type of circuits is fabricated by laminating patterned aluminum foils onto a nonwoven substrate in a high-speed roll-to-roll method. An isotropic conductive adhesive and an anisotropic conductive adhesive are used to assemble standard surface mount device components onto the fabricated circuits. The surface mount techniques are characterized by means of contact resistance measurements, component bonding strength tests, circuit bending tests, and scanning electron microscopy. An NFC tag with relative humidity sensing functionality is fabricated to evaluate the fabricated circuits to an electronic system level. 

Keyword

Adhesive joints

Adhesives

Aluminum

Bending strength

Bending tests

Fabrication

Humidity sensors

Scanning electron microscopy

Smart textiles

Substrates

Surface mount technology

System theory

Timing circuits

Aluminum conductors

Anisotropic conductive adhesives

Electronic system level

Electronics circuits

Isotropic conductive adhesives

Non-woven substrates

Resistance measurement

Surface mount device

Flexible electronics

Publication and Content Type

ref (subject category)

kon (subject category)