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Flexible Circuits B...
Flexible Circuits Based on Aluminum Conductor and Nonwoven Substrate
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- Li, Xiaotian (author)
- Mittuniversitetet,Institutionen för elektronikkonstruktion
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- Sidén, Johan, 1975- (author)
- Mittuniversitetet,Institutionen för elektronikkonstruktion
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- Andersson, Henrik, Dr, 1975- (author)
- Mittuniversitetet,Institutionen för elektronikkonstruktion
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- Ahmad, Jawad, 1985- (author)
- Mittuniversitetet,Institutionen för elektronikkonstruktion
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- Sawatdee, Anurak (author)
- RISE,RISE research institude of Sweden
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- Ohman, Robert (author)
- Skultuna Induflex AB, Sweden
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- Eriksson, Jeanette (author)
- Skultuna Induflex AB, Sweden
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- Genchel, Tove (author)
- Skultuna Induflex AB, Sweden
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(creator_code:org_t)
- Institute of Electrical and Electronics Engineers Inc. 2019
- 2019
- English.
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In: 2019 IEEE International Flexible Electronics Technology Conference, IFETC 2019. - : Institute of Electrical and Electronics Engineers Inc.. - 9781728117782
- Related links:
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https://miun.diva-po... (primary) (Raw object)
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https://urn.kb.se/re...
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https://doi.org/10.1...
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https://urn.kb.se/re...
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Abstract
Subject headings
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- Electronic textiles, integrating functional electronics circuits into fabric materials, are emerging as an important branch of flexible circuits. In this paper, we introduce a novel material combination for electronic textiles that can be used in implementing hybrid electronics. This type of circuits is fabricated by laminating patterned aluminum foils onto a nonwoven substrate in a high-speed roll-to-roll method. An isotropic conductive adhesive and an anisotropic conductive adhesive are used to assemble standard surface mount device components onto the fabricated circuits. The surface mount techniques are characterized by means of contact resistance measurements, component bonding strength tests, circuit bending tests, and scanning electron microscopy. An NFC tag with relative humidity sensing functionality is fabricated to evaluate the fabricated circuits to an electronic system level.
Keyword
- Adhesive joints
- Adhesives
- Aluminum
- Bending strength
- Bending tests
- Fabrication
- Humidity sensors
- Scanning electron microscopy
- Smart textiles
- Substrates
- Surface mount technology
- System theory
- Timing circuits
- Aluminum conductors
- Anisotropic conductive adhesives
- Electronic system level
- Electronics circuits
- Isotropic conductive adhesives
- Non-woven substrates
- Resistance measurement
- Surface mount device
- Flexible electronics
Publication and Content Type
- ref (subject category)
- kon (subject category)
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- By the author/editor
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Li, Xiaotian
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Sidén, Johan, 19 ...
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Andersson, Henri ...
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Ahmad, Jawad, 19 ...
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Sawatdee, Anurak
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Ohman, Robert
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show more...
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Eriksson, Jeanet ...
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Genchel, Tove
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- Articles in the publication
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2019 IEEE Intern ...
- By the university
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RISE
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Mid Sweden University