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Stress-minimized pa...
Stress-minimized packaging of inertial sensors using wire bonding
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- Schröder, Stephan, 1979- (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Nafari, Alexandra (author)
- RISE,Acreo
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- Persson, Katrin (author)
- RISE,Acreo
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- Westby, Eskild R. (author)
- Sensonor AS, Norway
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- Fischer, Andreas C. (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Stemme, Göran (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Niklaus, Frank (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Haasl, Sjoerd (author)
- KTH,Centrum för teknik i medicin och hälsa, CTMH,KTH Royal Institute of Technology, Sweden
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(creator_code:org_t)
- IEEE conference proceedings, 2013
- 2013
- English.
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In: 2013 Transducers and Eurosensors XXVII. - : IEEE conference proceedings. - 9781467359818 - 9781467359832 ; , s. 1962-1965
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https://urn.kb.se/re...
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https://doi.org/10.1...
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Abstract
Subject headings
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- This paper presents a packaging approach for inertial sensors using wire bonding technology. The die is mounted exclusively by bond wires on the front- and backside to the package. Conventional single-side die attach to substrates, such as gluing, is abandoned. The approach is characterized by its novel and symmetric die attach concept as well as its simplicity of applying a standard wire bonding process. The wire bond attachment facilitates significant reduction of thermally induced mechanical stresses. The attachment concept is characterized in terms of attachment stiffness and potential die resonances using Laser Doppler Vibrometry (LDV). White-light interferometry is used to investigate stress related warping that is induced by the die attachment process.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- die attach
- inertial sensors
- Laser Doppler Vibrometry
- Low-stress
- packaging
- white-light interferometry
- wire bonding
- Die-attach
- Inertial sensor
- Low stress
- Actuators
- Electronics packaging
- Inertial navigation systems
- Interferometry
- Laser Doppler velocimeters
- Microsystems
- Solid-state sensors
- Stresses
Publication and Content Type
- ref (subject category)
- kon (subject category)
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