SwePub
Sök i LIBRIS databas

  Extended search

onr:"swepub:oai:DiVA.org:ri-49922"
 

Search: onr:"swepub:oai:DiVA.org:ri-49922" > Very large scale he...

  • 1 of 1
  • Previous record
  • Next record
  •    To hitlist

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

Forsberg, Fredrik (author)
KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
Roxhed, Niclas (author)
KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
Fischer, Andreas C., 1982- (author)
KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
show more...
Samel, Björn (author)
RISE,Acreo,Acreo AB
Ericsson, Per (author)
RISE,Acreo,Acreo AB
Hoivik, Nils D. (author)
Sensonor AS, Norway
Lapadatu, Adriana Cozma (author)
Sensonor AS, Norway
Bring, Martin (author)
Sensonor AS, Norway
Kittilsland, Gjermund (author)
Sensonor AS, Norway
Stemme, Göran (author)
KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
Niklaus, Frank (author)
KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
show less...
 (creator_code:org_t)
Elsevier BV, 2013
2013
English.
In: Infrared physics & technology. - : Elsevier BV. - 1350-4495 .- 1879-0275. ; 60, s. 251-259
  • Journal article (peer-reviewed)
Abstract Subject headings
Close  
  • Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.

Keyword

Bolometer
IR
MEMS
Thermal imaging
Very large scale heterogeneous integration
Automotive applications
Cost-sensitive applications
Fabrication and characterizations
Heterogeneous integration
Long-wavelength infrared ranges
Noncontact measurements
Temperature coefficient of resistance
Wafer level vacuum packaging
Bolometers
CMOS integrated circuits
Cost reduction
Infrared detectors
Infrared imaging
Infrared radiation
Integration
Iridium
Semiconductor quantum wells
Silicon alloys
Technology
Vacuum
Wafer bonding
Electronics packaging

Publication and Content Type

ref (subject category)
art (subject category)

Find in a library

To the university's database

  • 1 of 1
  • Previous record
  • Next record
  •    To hitlist

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.

 
pil uppåt Close

Copy and save the link in order to return to this view