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Heterogeneous 3D in...
Heterogeneous 3D integration of 17 μm pitch Si/SiGe quantum well bolometer arrays for infrared imaging systems
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- Forsberg, Fredrik (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Fischer, Andreas C., 1982- (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Roxhed, Niclas (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Samel, Björn (author)
- RISE,Acreo,Acreo AB
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- Ericsson, Per (author)
- RISE,Acreo,Acreo AB
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- Stemme, Göran (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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- Niklaus, Frank (author)
- KTH,Mikro- och nanosystemteknik,KTH Royal Institute of Technology, Sweden
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(creator_code:org_t)
- 2013-03-06
- 2013
- English.
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In: Journal of Micromechanics and Microengineering. - : IOP Publishing. - 0960-1317 .- 1361-6439. ; 23:4
- Related links:
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https://urn.kb.se/re...
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https://doi.org/10.1...
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https://urn.kb.se/re...
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Abstract
Subject headings
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- This paper reports on the realization of 17 μm × 17 μm pitch bolometer arrays for uncooled infrared imagers. Microbolometer arrays have been available in primarily defense applications since the mid-1980s and are typically based on deposited thin films on top of CMOS wafers that are surface-machined into sensor pixels. This paper instead focuses on the heterogeneous integration of monocrystalline Si/SiGe quantum-well-based thermistor material in a CMOS-compliant process using adhesive wafer bonding. The high-quality monocrystalline thermistor material opens up for potentially lower noise compared to commercially available uncooled microbolometer arrays together with a competitive temperature coefficient of resistance (TCR). Characterized bolometers had a TCR of -2.9% K-1 in vacuum, measured thermal conductances around 5 × 10-8 W K-1 and thermal time constants between 4.9 and 8.5 ms, depending on the design. Complications in the fabrication of stress-free bolometer legs and low-noise contacts are discussed and analyzed.
Keyword
- Adhesive wafer bonding
- Heterogeneous integration
- Microbolometer arrays
- Temperature coefficient of resistance
- Thermal conductance
- Thermal time constants
- Thermistor materials
- Uncooled microbolometers
- Infrared detectors
- Infrared imaging
- Semiconductor quantum wells
- Temperature sensors
- Thermistors
- Bolometers
Publication and Content Type
- ref (subject category)
- art (subject category)
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