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A web-based interac...
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Wang, PeijunLund University,Lunds universitet,Innovation,Institutionen för designvetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,Department of Design Sciences,Departments at LTH,Faculty of Engineering, LTH
(author)
A web-based interactive virtual environment for mobile phone customization
- Article/chapterEnglish2005
Publisher, publication year, extent ...
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2005-03-14
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ASME International,2005
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4 s.
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electronicrdacarrier
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LIBRIS-ID:oai:lup.lub.lu.se:54954993-508f-4ab9-966b-e6dbb3e51798
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https://lup.lub.lu.se/record/246671URI
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https://doi.org/10.1115/1.1818685DOI
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Language:English
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Summary in:English
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Subject category:art swepub-publicationtype
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Subject category:ref swepub-contenttype
Notes
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With globalization, more and more companies are becoming multisited. Efficient and timely collaboration and communication among the development team members become critical for product success. This paper proposes a web-based virtual environment for mobile phone customization, named VMPDS (Virtual Mobile Phone Design Space). The features of this system include the combination of web technology and VR (Virtual Reality) technology, the ability to deal with and extend the product model database, adequate interaction for three-dimensional product model customization, and usefulness for the examination and evaluation of product concept design. The system is implemented by using standard open technologies to assure accessibility and platform independence.
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Bjärnemo, RobertLund University,Lunds universitet,Innovation,Institutionen för designvetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,Department of Design Sciences,Departments at LTH,Faculty of Engineering, LTH(Swepub:lu)mkon-rbj
(author)
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Motte, DamienLund University,Lunds universitet,Innovation,Institutionen för designvetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,Department of Design Sciences,Departments at LTH,Faculty of Engineering, LTH(Swepub:lu)mkon-dmo
(author)
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InnovationInstitutionen för designvetenskaper
(creator_code:org_t)
Related titles
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In:Journal of Computing and Information Science in Engineering: ASME International5:1, s. 67-701530-98271944-7078
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