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Aerosol Jet Printing of Graphene and Carbon Nanotube Patterns on Realistically Rugged Substrates

Kaindl, Reinhard (author)
Joanneum Research Forschungsgesellschaft mbH
Gupta, Tushar (author)
Technische Universität Wien,Vienna University of Technology
Bluemel, Alexander (author)
Joanneum Research Forschungsgesellschaft mbH
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Pei, Songfeng (author)
Chinese Academy of Sciences
Hou, Peng-Xiang (author)
Chinese Academy of Sciences
Liu, Chang (author)
Chinese Academy of Sciences
Patter, Paul (author)
Joanneum Research Forschungsgesellschaft mbH
Popovic, Karl (author)
Joanneum Research Forschungsgesellschaft mbH
Dergez, David (author)
Elibol, Kenan (author)
Universität Wien,University of Vienna
Schaffer, Erhard (author)
Universität Wien,University of Vienna
Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Eder, Dominik (author)
Technische Universität Wien,Vienna University of Technology
Kieslinger, Dietmar (author)
Ren, Wencai (author)
Chinese Academy of Sciences
Hartmann, Paul (author)
Joanneum Research Forschungsgesellschaft mbH
Waldhauser, Wolfgang (author)
Joanneum Research Forschungsgesellschaft mbH
Bayer, Bernhard C. (author)
Universität Wien,University of Vienna,Technische Universität Wien,Vienna University of Technology
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 (creator_code:org_t)
2021-12-10
2021
English.
In: ACS Omega. - : American Chemical Society (ACS). - 2470-1343. ; 6:50, s. 34301-34313
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • Direct-write additive manufacturing of graphene and carbon nanotube (CNT) patterns by aerosol jet printing (AJP) is promising for the creation of thermal and electrical interconnects in (opto)electronics. In realistic application scenarios, this however often requires deposition of graphene and CNT patterns on rugged substrates such as, for example, roughly machined and surface oxidized metal block heat sinks. Most AJP of graphene/CNT patterns has thus far however concentrated on flat wafer-or foil type substrates. Here, we demonstrate AJP of graphene and single walled CNT (SWCNT) patterns on realistically rugged plasma electrolytic-oxidized (PEO) Al blocks, which are promising heat sink materials. We show that AJP on the rugged substrates offers line resolution of down to similar to 40 mu m width for single AJP passes, however, at the cost of noncomplete substrate coverage including noncovered mu m-sized pores in the PEO Al blocks. With multiple AJP passes, full coverage including coverage of the pores is, however, readily achieved. Comparing archetypical aqueous and organic graphene and SWCNT inks, we show that the choice of the ink system drastically influences the nanocarbon AJP parameter window, deposit microstructure including crystalline quality, compactness of deposit, and inter/intrapass layer adhesion for multiple passes. Simple electrical characterization indicates aqueous graphene inks as the most promising choice for AJP-deposited electrical interconnect applications. Our parameter space screening thereby forms a framework for rational process development for graphene and SWCNT AJP on application-relevant, rugged substrates.

Subject headings

NATURVETENSKAP  -- Kemi -- Oorganisk kemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Inorganic Chemistry (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Bearbetnings-, yt- och fogningsteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Manufacturing, Surface and Joining Technology (hsv//eng)
NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)

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