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Fabrication process...
Fabrication process and 110 GHz measurement result of MS-to-CPW RF-via transition for RF-MEMS devices packaging applications
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- Hsu, Li-Han, 1981 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Wu, Wei-Cheng, 1979 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Chang, E. Y. (author)
- National Chiao Tung University
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- Zirath, Herbert, 1955 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Wu, Y. C. (author)
- National Chiao Tung University
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- Wang, C. T. (author)
- National Chiao Tung University
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- Tsai, S. P. (author)
- National Chiao Tung University
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(creator_code:org_t)
- ISBN 9781893580138
- 2009
- 2009
- English.
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In: 2009 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2009. - 9781893580138
- Related links:
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https://research.cha...
Abstract
Subject headings
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- This paper presents the fabrication process of RF-via (0-level) and flip-chip bump (1-level) transitions for applications of packaging MS (microstrip) RF-MEMS devices. The interconnect structure with MS-to-CPW transition between GaAs MEMS substrate and Al2O3 motherboard was in-house fabricated. A novel fabrication process for RF-MEMS packaging is in detail. After fabrication, the samples were measured up to 110 GHz using on-wafer probing measurement. From the measured results, the insertion loss of entire interconnect structure is better than -2 dB up to 100 GHz, documenting the feasibility for millimeter-wave RF-MEMS devices packaging applications.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- Fabrication
- Packaging
- Microelectromechanical device
- Microstrip
- Millimeter-wave
Publication and Content Type
- kon (subject category)
- ref (subject category)
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Hsu, Li-Han, 198 ...
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Wu, Wei-Cheng, 1 ...
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Chang, E. Y.
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Zirath, Herbert, ...
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Wu, Y. C.
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Wang, C. T.
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show more...
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Tsai, S. P.
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show less...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
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2009 Internation ...
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Chalmers University of Technology