Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

• Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of Polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The Scanning Electron Microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Publication and Content Type

kon (subject category)

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