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RF Characterisation...
RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints
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- Wang, Xu (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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Cheng, Zhaonian, 1942 (author)
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2006
- 2006
- English.
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In: Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06). ; , s. 123-127
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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