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Enhanced Electrode ...
Enhanced Electrode Deposition for On-Chip Integrated Micro-Supercapacitors by Controlled Surface Roughening
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- Vyas, Agin, 1992 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Wang, Kejian (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Anderson, Alec (author)
- University of California
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- Velasco, Andres (author)
- Katholieke Universiteit Leuven,Chalmers tekniska högskola,Chalmers University of Technology
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- Van Den Eeckhoudt, Ruben (author)
- Katholieke Universiteit Leuven,Chalmers tekniska högskola,Chalmers University of Technology
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- Haque, Mohammad Mazharul, 1984 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Li, Qi, 1990 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Smith, Anderson David, 1985 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Lundgren, Per, 1968 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Enoksson, Peter, 1957 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2020-03-06
- 2020
- English.
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In: ACS Omega. - : American Chemical Society (ACS). - 2470-1343. ; 5:10, s. 5219-5228
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Abstract
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- On-chip micro-supercapacitors (MSCs), integrated with energy harvesters, hold substantial promise for developing self-powered wireless sensor systems. However, MSCs have conventionally been manufactured through techniques incompatible with semiconductor fabrication technology, the most significant bottleneck being the electrode deposition technique. Utilization of spin-coating for electrode deposition has shown potential to deliver several complementary metal-oxide-semiconductor (CMOS)-compatible MSCs on a silicon substrate. Yet, their limited electrochemical performance and yield over the substrate have remained challenges obstructing their subsequent integration. We report a facile surface roughening technique for improving the wafer yield and the electrochemical performance of CMOS-compatible MSCs, specifically for reduced graphene oxide as an electrode material. A 4 nm iron layer is deposited and annealed on the wafer substrate to increase the roughness of the surface. In comparison to standard nonroughened MSCs, the increase in surface roughness leads to a 78% increased electrode thickness, 21% improvement in mass retention, 57% improvement in the uniformity of the spin-coated electrodes, and a high yield of 87% working devices on a 2″ silicon substrate. Furthermore, these improvements directly translate to higher capacitive performance with enhanced rate capability, energy, and power density. This technique brings us one step closer to fully integrable CMOS-compatible MSCs in self-powered systems for on-chip wireless sensor electronics. ©
Subject headings
- NATURVETENSKAP -- Kemi -- Oorganisk kemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Inorganic Chemistry (hsv//eng)
- NATURVETENSKAP -- Kemi -- Materialkemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Materials Chemistry (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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ACS Omega
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- By the author/editor
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Vyas, Agin, 1992
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Wang, Kejian
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Anderson, Alec
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Velasco, Andres
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Van Den Eeckhoud ...
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Haque, Mohammad ...
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show more...
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Li, Qi, 1990
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Smith, Anderson ...
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Lundgren, Per, 1 ...
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Enoksson, Peter, ...
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- NATURAL SCIENCES
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NATURAL SCIENCES
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and Chemical Science ...
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and Inorganic Chemis ...
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- NATURAL SCIENCES
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NATURAL SCIENCES
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and Chemical Science ...
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and Materials Chemis ...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
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and Other Electrical ...
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ACS Omega
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Chalmers University of Technology