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Enhanced Electrode Deposition for On-Chip Integrated Micro-Supercapacitors by Controlled Surface Roughening

Vyas, Agin, 1992 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Wang, Kejian (author)
Chalmers tekniska högskola,Chalmers University of Technology
Anderson, Alec (author)
University of California
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Velasco, Andres (author)
Katholieke Universiteit Leuven,Chalmers tekniska högskola,Chalmers University of Technology
Van Den Eeckhoudt, Ruben (author)
Katholieke Universiteit Leuven,Chalmers tekniska högskola,Chalmers University of Technology
Haque, Mohammad Mazharul, 1984 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Li, Qi, 1990 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Smith, Anderson David, 1985 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Lundgren, Per, 1968 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Enoksson, Peter, 1957 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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 (creator_code:org_t)
2020-03-06
2020
English.
In: ACS Omega. - : American Chemical Society (ACS). - 2470-1343. ; 5:10, s. 5219-5228
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • On-chip micro-supercapacitors (MSCs), integrated with energy harvesters, hold substantial promise for developing self-powered wireless sensor systems. However, MSCs have conventionally been manufactured through techniques incompatible with semiconductor fabrication technology, the most significant bottleneck being the electrode deposition technique. Utilization of spin-coating for electrode deposition has shown potential to deliver several complementary metal-oxide-semiconductor (CMOS)-compatible MSCs on a silicon substrate. Yet, their limited electrochemical performance and yield over the substrate have remained challenges obstructing their subsequent integration. We report a facile surface roughening technique for improving the wafer yield and the electrochemical performance of CMOS-compatible MSCs, specifically for reduced graphene oxide as an electrode material. A 4 nm iron layer is deposited and annealed on the wafer substrate to increase the roughness of the surface. In comparison to standard nonroughened MSCs, the increase in surface roughness leads to a 78% increased electrode thickness, 21% improvement in mass retention, 57% improvement in the uniformity of the spin-coated electrodes, and a high yield of 87% working devices on a 2″ silicon substrate. Furthermore, these improvements directly translate to higher capacitive performance with enhanced rate capability, energy, and power density. This technique brings us one step closer to fully integrable CMOS-compatible MSCs in self-powered systems for on-chip wireless sensor electronics. ©

Subject headings

NATURVETENSKAP  -- Kemi -- Oorganisk kemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Inorganic Chemistry (hsv//eng)
NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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