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Reliability study f...
Reliability study for high temperature stable conductive adhesives
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- Tao, W. (author)
- Shanghai University
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- Chen, Si, 1981 (author)
- Shanghai University
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- Berggren, Pär, 1982 (author)
- SHT Smart High-Tech AB
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- ISBN 9781424467563
- 2010
- 2010
- English.
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In: 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. - 9781424467563 ; , s. 74-77
- Related links:
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http://dx.doi.org/10...
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https://doi.org/10.1...
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https://research.cha...
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Abstract
Subject headings
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- With fast development of electronic packaging, the conductive adhesives were widely used in surface mount and chip interconnection. As an alternative to solder, it has many advantages, such as low processing temperature, less environment contamination and fine pitch capability. However, conductive adhesive joining technology also simultaneously faces a lot of challenges. The major problem of current conductive adhesives is easy to degrade during temperature and humidity aging. Therefore a high temperature stable matrix was developed for conductive adhesive fabrication. Based on this matrix, a kind of isotropic conductive adhesive (ICA) was fabricated in this work. The curing behavior of ICA was investigated by Differential Scanning Calorimeter (DSC). The properties such as glass transition temperature (Tg), storage modulus were detected by Dynamic Mechanical Analyzer (DMA). Thermogravimetric Analysis (TGA) was used to determine the decomposition behavior. The humidity test was subsequently carried out to evaluate moisture resistance of ICA. The electrical resistances of the ICA samples were measured by the multimeter. During humidity test, no obvious change of electrical resistance of ICA samples was observed. ©2010 IEEE.
Subject headings
- NATURVETENSKAP -- Fysik (hsv//swe)
- NATURAL SCIENCES -- Physical Sciences (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Annan materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Other Materials Engineering (hsv//eng)
Keyword
- Contact resistance
- Isotropic conductive adhesives
- Humidity
Publication and Content Type
- kon (subject category)
- vet (subject category)
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