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3D integrated super...
3D integrated superconducting qubits
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- Rosenberg, D. (author)
- MIT Lincoln Laboratory
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- Kim, D. (author)
- MIT Lincoln Laboratory
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- Das, R. (author)
- MIT Lincoln Laboratory
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- Yost, D. (author)
- MIT Lincoln Laboratory
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- Gustavsson, S. (author)
- Massachusetts Institute of Technology (MIT)
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- Hover, D. (author)
- MIT Lincoln Laboratory
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- Krantz, Philip, 1984 (author)
- Massachusetts Institute of Technology (MIT)
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- Melville, A. (author)
- MIT Lincoln Laboratory
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- Racz, L. (author)
- MIT Lincoln Laboratory
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- Samach, G. O. (author)
- MIT Lincoln Laboratory
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- Weber, S.J. (author)
- MIT Lincoln Laboratory
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- Yan, F. (author)
- Massachusetts Institute of Technology (MIT)
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- Yoder, J.L. (author)
- MIT Lincoln Laboratory
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- Kerman, A.J. (author)
- MIT Lincoln Laboratory
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- Oliver, W. D. (author)
- Massachusetts Institute of Technology (MIT)
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(creator_code:org_t)
- 2017-10-09
- 2017
- English.
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In: npj Quantum Information. - : Springer Science and Business Media LLC. - 2056-6387. ; 3
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Abstract
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- As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2, echo > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.
Subject headings
- NATURVETENSKAP -- Fysik -- Annan fysik (hsv//swe)
- NATURAL SCIENCES -- Physical Sciences -- Other Physics Topics (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology -- Nano-technology (hsv//eng)
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- art (subject category)
- ref (subject category)
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- By the author/editor
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Rosenberg, D.
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Kim, D.
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Das, R.
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Yost, D.
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Gustavsson, S.
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Hover, D.
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show more...
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Krantz, Philip, ...
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Melville, A.
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Racz, L.
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Samach, G. O.
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Weber, S.J.
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Yan, F.
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Yoder, J.L.
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Kerman, A.J.
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Oliver, W. D.
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show less...
- About the subject
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- NATURAL SCIENCES
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NATURAL SCIENCES
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and Physical Science ...
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and Other Physics To ...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Nano technology
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and Nano technology
- Articles in the publication
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npj Quantum Info ...
- By the university
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Chalmers University of Technology