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Simplified Josephson-junction fabrication process for reproducibly high-performance superconducting qubits

Osman, Amr, 1993 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Simon, James, 1997 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Bengtsson, Andreas, 1991 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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Kosen, Sandoko, 1991 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Krantz, Philip, 1984 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Perez Lozano, Daniel, 1990 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Scigliuzzo, Marco, 1987 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Delsing, Per, 1959 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Bylander, Jonas, 1978 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Fadavi Roudsari, Anita, 1978 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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 (creator_code:org_t)
AIP Publishing, 2021
2021
English.
In: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 118:6
  • Journal article (peer-reviewed)
Abstract Subject headings
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  • We introduce a simplified fabrication technique for Josephson junctions and demonstrate superconducting Xmon qubits with T1 relaxation times averaging above 50 μs (Q > 1.5 × 1 0 6). Current shadow-evaporation techniques for aluminum-based Josephson junctions require a separate lithography step to deposit a patch that makes a galvanic, superconducting connection between the junction electrodes and the circuit wiring layer. The patch connection eliminates parasitic junctions, which otherwise contribute significantly to dielectric loss. In our patch-integrated cross-type junction technique, we use one lithography step and one vacuum cycle to evaporate both the junction electrodes and the patch. This eliminates a key bottleneck in manufacturing superconducting qubits by reducing the fabrication time and cost. In a study of more than 3600 junctions, we show an average resistance variation of 3.7% on a wafer that contains forty 0.5 × 0.5-cm2 chips, with junction areas ranging between 0.01 and 0.16 μm2. The average on-chip spread in resistance is 2.7%, with 20 chips varying between 1.4% and 2%. For the junction sizes used for transmon qubits, we deduce a wafer-level transition-frequency variation of 1.7%-2.5%. We show that 60%-70% of this variation is attributed to junction-area fluctuations, while the rest is caused by tunnel-junction inhomogeneity. Such high frequency predictability is a requirement for scaling-up the number of qubits in a quantum computer.

Subject headings

NATURVETENSKAP  -- Fysik -- Atom- och molekylfysik och optik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences -- Atom and Molecular Physics and Optics (hsv//eng)
NATURVETENSKAP  -- Fysik -- Annan fysik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences -- Other Physics Topics (hsv//eng)
NATURVETENSKAP  -- Fysik -- Den kondenserade materiens fysik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences -- Condensed Matter Physics (hsv//eng)

Keyword

qubits
Superconducting Resonators
Josephson Junctions

Publication and Content Type

art (subject category)
ref (subject category)

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