A Simulation Based Comparative Study on Thermal and Mechanical Performance of Silicone Grease and Graphene-enhanced Thermal Pad for Single-chip and Multi-chip Packaging Applications

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik -- Produktionsteknik, arbetsvetenskap och ergonomi (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering -- Production Engineering, Human Work Science and Ergonomics (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

Keyword

Simulation

Graphene-enhanced thermal pad

multi-chip packaging

Thermal interface material

cooling

single-chip

Publication and Content Type

kon (subject category)

ref (subject category)