Thermal properties of TIM using CNTs forest in electronics packaging

• Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a path for interfacial heat transfer. Owing to the exceptional thermal properties of carbon nanotubes (CNT), TIMs based on CNTs have received much attention in recent years. In this study, heat dissipation performance of vertically aligned carbon nanotubes (VACNT) arrays as TIM in electronic packing was analyzed. Vertically aligned carbon nanotubes with length of 245?m and 763?m were synthesized on a silicon substrate by chemical vapor deposition respectively. Morphology of the vertically aligned carbon nanotubes was characterized by scanning electron microscope. The hotspot temperature of thermal test chip with vertically aligned carbon nanotubes were characterized by resistance temperature detector method and infrared imaging method.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Keramteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Ceramics (hsv//eng)

NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)

NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)

TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Annan materialteknik (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Other Materials Engineering (hsv//eng)

Keyword

resistance temperature detector

hotspot

VACNT

dissipation

thermal test chip

heat

Publication and Content Type

kon (subject category)

ref (subject category)