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Carbon-Nanotube Thr...
Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration
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- Wang, Teng, 1983 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Jeppson, Kjell, 1947 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Ye, L. (author)
- SHT Smart High-Tech AB
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2011-06-21
- 2011
- English.
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In: Small. - : Wiley. - 1613-6810 .- 1613-6829. ; 7:16, s. 2313-2317
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http://dx.doi.org/10...
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https://doi.org/10.1...
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Abstract
Subject headings
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- Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measurements are approximately 1.2 × 10 -3 Ω cm 2 and 4.5 × 10 -4 Ω cm 2 , respectively. © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Publication and Content Type
- art (subject category)
- ref (subject category)
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