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A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Fan, Yi (author)
Shanghai University
Fu, Yifeng, 1984 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Zhang, Yan (author)
Shanghai University
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Wang, Teng, 1983 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Wang, X. (author)
Shanghai University
Cheng, Zhaonian, 1942 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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 (creator_code:org_t)
ISBN 9781424427406
2008
2008
English.
In: 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008. - 9781424427406
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • In this work, silicon microchannel coolers were made using the Deep Ion Reactive Etching (DIRE) technique. Stable and homogeneous Carbon NanoTube (CNT) suspension was also prepared. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing controllable flow, and a fan system for cooling the circular fluid. Beside the inlet and outlet of the test module, two thermocouples and pressure gauges were set up to measure the temperature and pressure of the fluids. The heat removal of the silicon microchannel cooler using different CNT volume fraction of suspension coolant was studied. The results show that the microchannel cooler with CNT suspension as coolant could strengthen the heat removal capability of microchannel cooler. In addition to heat transfer enhancement, the microchannel cooler with CNT suspension coolant did not produce extra pressure drop in the present study.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)

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