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- Ju, Guo-Kui (author)
The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths
- Article/chapterEnglish2008
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- 2008
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- LIBRIS-ID:oai:research.chalmers.se:4193c69f-8379-41aa-9aea-5a36d78eb64c
- https://research.chalmers.se/publication/72907URI
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- Language:English
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- Wei, Xi-cheng (author)
- Sun, Peng,1979Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)pengs (author)
- Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
- Chalmers tekniska högskola (creator_code:org_t)
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- In:Soldering and Surface Mount Technology20:3, s. 4-101758-68360954-0911
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