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- Fu, Yifeng,1984Chalmers tekniska högskola,Chalmers University of Technology (author)
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
- Article/chapterEnglish2016
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- 2016
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- LIBRIS-ID:oai:research.chalmers.se:4c15e100-784f-4a87-a810-efdf166b16b3
- ISBN:9781509014026
- https://doi.org/10.1109/ESTC.2016.7764713DOI
- https://research.chalmers.se/publication/248217URI
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- Language:English
- Summary in:English
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- Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various post-growth processing of CNTs, such as doping, densification, transfer, metallization, etc., for the improvement of their performance will be reviewed.
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- Mu, Wei,1985Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)weim (author)
- Sun, Shuangxi,1986Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)shuangxi (author)
- Wang, N.Shanghai University (author)
- Huang, S.Shanghai University (author)
- Liu, Johan,1960Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)jliu (author)
- Chalmers tekniska högskolaShanghai University (creator_code:org_t)
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- In:2016 6th Electronic System-Integration Technology Conference (Estc), s. Article no 7764713-9781509014026
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