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Optimized cleaning ...
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Ljungberg, Karin
(author)
Optimized cleaning processes for silicon wafer bonding
- Article/chapterEnglish1996
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LIBRIS-ID:oai:research.chalmers.se:5156233b-45ee-4ec0-a257-70fc8cc9214e
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https://research.chalmers.se/publication/17787URI
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Language:English
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Summary in:English
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Subject category:kon swepub-publicationtype
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Subject category:ref swepub-contenttype
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The use of SPFM (H2SO4-H2O2-HF) at low HF concentrations (10-1000 ppm) has been investigated as a pre-cleaning procedure for silicon direct bonding. This cleaning procedure can be tuned to simultaneously give hydrophilic surface properties, ensuring good bondability, and excellent electric properties, crucial for the application of direct bonding in device applications
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Bengtsson, Stefan,1961Chalmers tekniska högskola,Chalmers University of Technology(Swepub:cth)stefanb
(author)
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Chalmers tekniska högskola
(creator_code:org_t)
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In:Proceedings of the Third International Symposium on Ultra Clean Processing of Silicon Surfaces. UCPSS '96, s. 123-
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