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Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
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- Chen, Liu, 1973 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Lai, Zonghe, 1948 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- Cheng, Zhaonian, 1942 (author)
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- 2004
- 2004
- English.
- In: Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04).
- Conference paper (peer-reviewed)
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- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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