SwePub
Sök i LIBRIS databas

  Extended search

onr:"swepub:oai:research.chalmers.se:5edbf4e5-6d8d-4eba-8803-342cac4b3ee9"
 

Search: onr:"swepub:oai:research.chalmers.se:5edbf4e5-6d8d-4eba-8803-342cac4b3ee9" > Thermally Conductiv...

  • 1 of 1
  • Previous record
  • Next record
  •    To hitlist

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

Liu, Ya, 1991 (author)
Chalmers tekniska högskola,Chalmers University of Technology,Fudan University
Wang, Nan (author)
SHT Smart High-Tech AB
Ye, L. (author)
SHT Smart High-Tech AB
show more...
Zehri, Abdelhafid, 1989 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Nylander, Andreas, 1988 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Nkansah, Amos (author)
SHT Smart High-Tech AB
Lu, Hongbin (author)
Fudan University
Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology,Shanghai University
show less...
 (creator_code:org_t)
2019
2019
English.
In: Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. ; , s. 1-5
  • Conference paper (peer-reviewed)
Abstract Subject headings
Close  
  • Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400-800 W m-1 K-1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.

Subject headings

NATURVETENSKAP  -- Kemi -- Polymerkemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Polymer Chemistry (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Textil-, gummi- och polymermaterial (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Textile, Rubber and Polymeric Materials (hsv//eng)
NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)

Keyword

orientation
thermal management
electrical resistvity
die attach
PVP/BN composite film

Publication and Content Type

kon (subject category)
ref (subject category)

To the university's database

  • 1 of 1
  • Previous record
  • Next record
  •    To hitlist

Search outside SwePub

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.

 
pil uppåt Close

Copy and save the link in order to return to this view