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Thermally Conductiv...
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
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- Liu, Ya, 1991 (author)
- Chalmers tekniska högskola,Chalmers University of Technology,Fudan University
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- Wang, Nan (author)
- SHT Smart High-Tech AB
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- Ye, L. (author)
- SHT Smart High-Tech AB
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- Zehri, Abdelhafid, 1989 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Nylander, Andreas, 1988 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Nkansah, Amos (author)
- SHT Smart High-Tech AB
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- Lu, Hongbin (author)
- Fudan University
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology,Shanghai University
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(creator_code:org_t)
- 2019
- 2019
- English.
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In: Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. ; , s. 1-5
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https://doi.org/10.2...
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Abstract
Subject headings
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- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400-800 W m-1 K-1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
Subject headings
- NATURVETENSKAP -- Kemi -- Polymerkemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Polymer Chemistry (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Materialteknik -- Textil-, gummi- och polymermaterial (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering -- Textile, Rubber and Polymeric Materials (hsv//eng)
- NATURVETENSKAP -- Kemi -- Materialkemi (hsv//swe)
- NATURAL SCIENCES -- Chemical Sciences -- Materials Chemistry (hsv//eng)
Keyword
- orientation
- thermal management
- electrical resistvity
- die attach
- PVP/BN composite film
Publication and Content Type
- kon (subject category)
- ref (subject category)
To the university's database
- By the author/editor
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Liu, Ya, 1991
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Wang, Nan
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Ye, L.
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Zehri, Abdelhafi ...
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Nylander, Andrea ...
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Nkansah, Amos
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show more...
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Lu, Hongbin
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Liu, Johan, 1960
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show less...
- About the subject
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- NATURAL SCIENCES
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NATURAL SCIENCES
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and Chemical Science ...
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and Polymer Chemistr ...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Materials Engine ...
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and Textile Rubber a ...
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- NATURAL SCIENCES
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NATURAL SCIENCES
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and Chemical Science ...
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and Materials Chemis ...
- Articles in the publication
- Proceedings - 20 ...
- By the university
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Chalmers University of Technology