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Design and Development of Thin Film and LCP-Based System-on-Package Modules for RF/Wireless Applications
- Duo, Z. (author)
- Zheng, L. (author)
- Tenhunen, H. (author)
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- Chen, L. (author)
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- (creator_code:org_t)
- 2003
- 2003
- English.
- In: Proceedings of The 4th Pori Electronics Production and Packaging Technology Conference. ; , s. 205-213
- Conference paper (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- By the author/editor
- Duo, Z.
- Zheng, L.
- Tenhunen, H.
- Chen, L.
- Liu, Johan, 1960
- About the subject
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- ENGINEERING AND TECHNOLOGY
- ENGINEERING AND ...
- and Electrical Engin ...
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- Chalmers University of Technology
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